Mercury's family of SRAM based Single and Multi-Chip Packages (MCPs) are designed to give customers a high density memory solution that also meets the wide data widths necessary for their applications. These high speed memories use parallel addresses, data and control lines.

Starting at a density of 128k8 configurations these SRAM memories provide many benefits such as space savings versus single die packages, reduced I/O routing, reduced component count and placements, and industrial and military temperature ranges, qualified to DSCC requirements.

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