WS512K32NV-XH1X

Docs & Specs

Data Sheet

Application Notes

Overview

Model:  WS512K32NV-XH1X
16Mb 512Kx32 SRAM 3.3V Multi-Chip Package (MCP)

Features

  • Access Times of 15, 17, 20ns
  • Low Voltage Operation
  • Packaging:  66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP (Package 400)
  • Organized as 512Kx32; User Configurable as 2x512Kx16 or 4x512Kx8
  • Low Power Data Retention
  • Commercial, Industrial and Military Temperature Ranges
  • 5V Power Supply
  • Low Voltage Operation
    • 3.3V ± 10% Power Supply
  • Low Power CMOS
  • TTL Compatible Inputs and Outputs
  • Fully Static Operation
    • No clock or refresh required.
  • Three State Output.
  • Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation
  • Weight:  WS512K32NV-XH1X - 13 grams typical

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