RFS1080 RF System-in-Package

Redefining sensor edge processing with trusted, 2.5D packaging technology

  • slide

RF SiP

High frequency, direct-to-digital FPGA processing solution in a customizable, compact BGA package

The RFS1080 RF SiP is a broadband, chip-scale solution that enables multiple-channel direct digitization with industry-leading FPGA technology in a compact BGA package.  The RFS1080 contains integrated RF and digital chiplets – bonded together with dense, high-speed interconnects – for a single packaged design to satisfy your program requirements.

  • Wideband direct-to-digital operation
  • Industry-leading FPGA processing
  • Configurable 2.5D system-in-package capability
  • Defense-grade package and chip-level security integration     


DOWNLOAD DATASHEET

Redefining Sensor Edge Processing

2.5D System-in-Package Technology

Tom Smelker, VP and General Manager at Mercury Systems, shares how 2.5D microelectronics integration in semiconductor design is a powerful new trend that will redefine edge processing in the smallest form factor possible.

LEARN MORE

SWAP-C Comparison

RF SiP-based board vs. typical discrete board solution

 

Delivering RF and Digital Integration

The most effective radar and EW response techniques demand extremely low latency as signals transition back and forth between analog RF and digital. It has become essential to tightly integrate multiple RF and digital functions in sensor edge processing systems to effectively manage and manipulate data flows. Our system-in-package capability integrates die, assembly and packaging of RF and digital components, while optimizing real-time performance, miniaturization, cost and development time.

Benefits

Technology

  • Latest RF and processing from the commercial semiconductor industry with Mercury's 2.5D system-in-package capability
  • Industry-leading FPGA technology

Packaging

  • Compact ball grid array (BGA) package measuring less than 2"
  • Defense-grade package and chip-level security integration
  • Board-level integration support leveraging 3U and 6U OpenVPX and SOSA™ board solutions

Manufacturing

  • DMEA-trusted facility manufacturing

Customization

  • Rapid customization of commercial and customer chiplets
Electrical Specifications
  • Direct RF to digital, wideband ADC/DAC chiplets 
  • VHF to Ku, wideband transceivers 
  • Channel time alignment/synchronization support 
  • ADC/DAC calibration 
  • Digital interface transceivers to support multiple communication protocols including Ethernet and PCIe 
  • Broadband, chip-scale solution for radar and EW applications 
  • 1-8 GHz reference clock input 
SWaP Specifications
  • Dimensions (W x D x H): 50 mm x 50 mm x 5 mm 
  • BGA Pitch: 1 mm 
  • Weight: Less than 40 g 
  • Power: 140 W (typical) 
  • Up to 83% smaller, 64% lighter, 74% more efficient and 48% less expensive than next-generation board-level solutions 

Trusted Microelectronics

Trusted Supply Chain Starting at Chip Scale

To deliver the latest commercial technology purpose-built for mission-critical aerospace and defense applications, we start at chip scale with our high-density system-in-package technology, designed and manufactured in trusted and secure DMEA-accredited facilities. 

Electronic Warfare Solutions

Delivering Technology Innovation to the Spectrum

From chip scale to system scale, we make the most advanced technologies profoundly more  accessible to electronic warfare test, training and tactical applications.   

RELATED PRODUCTS

RFM3111

RFM3111

SOSA-aligned microwave transceiver

SEE MORE

DCM3220 Digital Transceiver

DCM3220 Digital Transceiver

3U OpenVPX 6.4 GSPS Converter Ultrascale+ FPGA

SEE MORE

HDS6605 Multiprocessing Board

HDS6605 Multiprocessing Board

6U OpenVPX Xeon (Cascade Lake) multiprocessing server blade

SEE MORE

Custom Device Packaging & Integration

Custom Device Packaging & Integration

Trusted 2.5D system-in-package and multi-chip module solutions

SEE MORE

RESOURCES

Video: Learn about Mercury's industry leading capabilities in 2.5D SiP microelectronics

Bringing trust and supply chain security to the latest commercial semiconductor solutions requires...

SEE MORE

Tech Brief: Microelectronics for the Sensor Edge

We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking...

SEE MORE

White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can...

SEE MORE

White Paper: Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)

At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs...

SEE MORE

Innovation That Matters®
BACK TO TOP

Copyright © 2021 Mercury Systems, Inc. All rights reserved.