RFS1080 RF System-in-Package
Redefining sensor edge processing with trusted, 2.5D packaging technology
Redefining sensor edge processing with trusted, 2.5D packaging technology
Redefining Sensor Edge Processing
Tom Smelker, VP and General Manager at Mercury Systems, shares how 2.5D microelectronics integration in semiconductor design is a powerful new trend that will redefine edge processing in the smallest form factor possible.
The most effective radar and EW response techniques demand extremely low latency as signals transition back and forth between analog RF and digital. It has become essential to tightly integrate multiple RF and digital functions in sensor edge processing systems to effectively manage and manipulate data flows. Our system-in-package capability integrates die, assembly and packaging of RF and digital components, while optimizing real-time performance, miniaturization, cost and development time.
To deliver the latest commercial technology purpose-built for mission-critical aerospace and defense applications, we start at chip scale with our high-density system-in-package technology, designed and manufactured in trusted and secure DMEA-accredited facilities.
From chip scale to system scale, we make the most advanced technologies profoundly more accessible to electronic warfare test, training and tactical applications.
SOSA-aligned microwave transceiver
3U OpenVPX 6.4 GSPS Converter Ultrascale+ FPGA
Intel Xeon Scalable 22-core server-class CPU, 192 GB DDR4, 100 GbE, PCIe Gen3, MOTS+ protection
Trusted 2.5D system-in-package and multi-chip module solutions
Optimized to solve the most advanced radar, cognitive EW and AI challenges, learn how Mercury ’s...
SWaP-optimized and ruggedized for operation in harsh environments, learn how Mercury ’s ACAP-based...
Learn about ACAP technology and how it's contributing to faster, stronger and more capable systems...
Online panel discussions regarding the future of radar in the defense community.