RFS1080 RF System-in-Package

Redefining sensor edge processing with trusted, 2.5D packaging technology

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RF SiP

High frequency, direct-to-digital FPGA processing solution in a customizable, compact BGA package

The RFS1080 RF SiP is a broadband, chip-scale solution that enables multiple-channel direct digitization with industry-leading FPGA technology in a compact BGA package.  The RFS1080 contains integrated RF and digital chiplets – bonded together with dense, high-speed interconnects – for a single packaged design to satisfy your program requirements.

  • Wideband direct-to-digital operation
  • Industry-leading FPGA processing
  • Configurable 2.5D system-in-package capability
  • Defense-grade package and chip-level security integration     


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Redefining Sensor Edge Processing

2.5D System-in-Package Technology

Tom Smelker, VP and General Manager at Mercury Systems, shares how 2.5D microelectronics integration in semiconductor design is a powerful new trend that will redefine edge processing in the smallest form factor possible.

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SWAP-C Comparison

RF SiP-based board vs. typical discrete board solution

 

Benefits

Technology

  • Latest RF and processing from the commercial semiconductor industry with Mercury's 2.5D system-in-package capability
  • Industry-leading FPGA technology

Packaging

  • Compact ball grid array (BGA) package measuring less than 2"
  • Defense-grade package and chip-level security integration
  • Board-level integration support leveraging 3U and 6U OpenVPX and SOSA™ board solutions

Manufacturing

  • DMEA-trusted facility manufacturing

Customization

  • Rapid customization of commercial and customer chiplets
Electrical Specifications
  • Direct RF to digital, wideband ADC/DAC chiplets 
  • VHF to Ku, wideband transceivers 
  • Channel time alignment/synchronization support 
  • ADC/DAC calibration 
  • Digital interface transceivers to support multiple communication protocols including Ethernet and PCIe 
  • Broadband, chip-scale solution for radar and EW applications 
  • 1-8 GHz reference clock input 
SWaP Specifications
  • Dimensions (W x D x H): 50 mm x 50 mm x 5 mm 
  • BGA Pitch: 1 mm 
  • Weight: Less than 40 g 
  • Power: 140 W (typical) 
  • Up to 83% smaller, 64% lighter, 74% more efficient and 48% less expensive than next-generation board-level solutions 

Trusted Microelectronics

Trusted Supply Chain Starting at Chip Scale

To deliver the latest commercial technology purpose-built for mission-critical aerospace and defense applications, we start at chip scale with our high-density system-in-package technology, designed and manufactured in trusted and secure DMEA-accredited facilities. 

Electronic Warfare Solutions

Delivering Technology Innovation to the Spectrum

From chip scale to system scale, we make the most advanced technologies profoundly more  accessible to electronic warfare test, training and tactical applications.   

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