Heterogeneous 2.5D system-in-package (SiP) technology, a new trend in microelectronics that includes multiple die inside the same package, is proving to be an excellent match for sensor-edge processing requirements, as it integrates high-performance chiplets to support direct digitization of wideband RF signals.
The Air Force's vision for the seamless networked warfighting concept known as Joint-All-Domain Command and...
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Image processing technology allows military aircraft to operate in past prohibited areas. Multi-sensor systems allow aircraft to operate in smoke, fog, snow, and heavy rain environments.
By integrating commercially developed processing and high-speed digitization at chip scale, new microelectronic devices are poised to accelerate the latest defense applications.
Disaggregating processing is now enabling low-latency, network-attached everything at the edge with high-speed Ethernet connectivity, from GPU servers to NVMe-over-fabric storage devices.
Tom Smelker, VP and GM of Mercury Microsystems, talks with 3DIncites on The Importance of Building Trusted and Secure Microelectronics.
Tom Smelker, VP & GM of Mercury Microelectronics, discusses the company's new RFS1140 RF system-in-package as well as its broader involvement with the U.S. Navy's SHIP project.
Executive Interview with Roger Wells, EVP and President, Mercury Microelectronics, by Gary Lerude, Microwave Journal
Radio frequency (RF) and microwave technology used in the military is everevolving and necessarily acclimating to the congested digital battlefield...
Mercury Systems is partnering with Intel to develop high-performance, ruggedized, and secure edge computing solutions that enable mission-critical applications in the harshest environments.
SBIR-to-transition successes include the Joint Avionics Reconfigurable Virtual Information System (JARVIS) mission computer and the Digital Data Set (DDS) Systems for the Navy's T-45, read more-