Article: Redefining Sensor Edge Processing

February 24, 2021 Erin Spring

Heterogeneous 2.5D system-in-package (SiP) technology, a new trend in microelectronics that includes multiple die inside the same package, is proving to be an excellent match for sensor-edge processing requirements, as it integrates high-performance chiplets to support direct digitization of wideband RF signals.

Previous Asset
Article:  The Promise of JADC2
Article: The Promise of JADC2

The Air Force's vision for the seamless networked warfighting concept known as Joint-All-Domain Command and...

Next Asset
Article: Special Purpose Appliances Fuel Singularity
Article: Special Purpose Appliances Fuel Singularity

Learn about building systems with GPUs and FPGAs including challenges, use cases, when to choose one over t...