RF, Microwave & Mixed-Signal

In order to minimize cost and time-to-market, the hardware must be flexible and modular. To address this emerging-need, we have developed a multi-channel, coherent system architecture.

Microwave Journal: Optimize the IF from mission to mission

We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.

Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.

By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.

Developing a precision-guided capability small enough to fit into a munition that weighs less than 0.1% of a cruise missile, all for a fraction of the cost.

IF Processing and Direct Conversion product family guide. These solutions enable the real-time digitization and processing of complex signals using the most advanced ADS, DAC and FPGA technology.

Microwave and digital open-architecture transceivers in 3U and 6U form factors plus high-performance rackmount converters up to 40HGz with a 2GHz IBW

From the proliferation of smart phones to the introduction of self-driving cars, the last decade has brought sweeping technological advances across all industries.

Whether you application demands space-level reliability for RF components or storage devices, we have the design, manufacturing and test expertise to deliver the right solution.