RF, Microwave & Mixed-Signal

From RF devices to mixed-signal systems, learn how compact and modular RF technology delivers the cutting-edge performance your system requires.

  • Understanding Conformance to the SOSA Technical Standard

    Understanding Conformance to the SOSA Technical Standard

    The Open Group Sensor Open System Architecture, known as the SOSA™ Technical Standard, applies a modular open systems approach (MOSA) to high-performance defense sensor systems such as radar, electron

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  • Podcast:  Deep dive on Pentek acquisition by Mercury Systems and Radar/EW Market Trends

    Podcast: Deep dive on Pentek acquisition by Mercury Systems and Radar/EW Market Trends

    Military Embedded Systems Deep Dive Podcast: Mercury Systems' FPGA single-board computers, data-acquisition boards, recording systems, and other products for radar, signals intelligence (SIGINT)

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  • Changing the RF and Spectrum Processing Industry

    Changing the RF and Spectrum Processing Industry

    It’s finally here. Trusted, onshore 2.5D custom microelectronics. Listen as Tom Smelker, VP and general manager, Microsystems, discusses Mercury’s collaboration with semiconductor partners to...

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  • RF, Microwave and Mixed-Signal Solutions

    RF, Microwave and Mixed-Signal Solutions

    An overview of Mercury’s broad RF, microwave and mixed-signal solutions including compact components and highly integrated, modular assemblies.

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  • Innovation That's Agile: A Multi-Channel, Coherent Receiver System

    Innovation That's Agile: A Multi-Channel, Coherent Receiver System

    In order to minimize cost and time-to-market, the hardware must be flexible and modular. To address this emerging-need, we have developed a multi-channel, coherent system architecture.

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  • Agile IF Architectures Enable Flexible EW and ELINT Systems

    Agile IF Architectures Enable Flexible EW and ELINT Systems

    Microwave Journal: Optimize the IF from mission to mission

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  • Tech Brief:  Microelectronics for the Sensor Edge

    Tech Brief: Microelectronics for the Sensor Edge

    We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.

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  • Article:  Redefining Sensor Edge Processing

    Article: Redefining Sensor Edge Processing

    Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.

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  • White Paper:  Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

    White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

    By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.

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  • Emerging Threats Drive RF and Microwave Component Design Trends for EW

    Emerging Threats Drive RF and Microwave Component Design Trends for EW

    To address emerging electronic warfare (EW) threats, which are becoming increasingly more agile and moving up the spectrum, radio frequency (RF) and microwave component designs are also evolving.

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  • Can I Get a SOSA-Aligned Everything, Please?

    Can I Get a SOSA-Aligned Everything, Please?

    SOSA can provide the balance between plug-and-play and secure sustainability for multiple devices to work together seamlessly. This new technology architecture can save time, reduce SWaP, and...

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  • A Novel RF and Digital Microelectronics Architecture for Precision Guided Weapons

    A Novel RF and Digital Microelectronics Architecture for Precision Guided Weapons

    Developing a precision-guided capability small enough to fit into a munition that weighs less than 0.1% of a cruise missile, all for a fraction of the cost.

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  • GaN Power Amplifiers

    GaN Power Amplifiers

    GaN-based power amplifiers are ideal choice when your program requires high power, at high frequencies and in a small space.

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  • White Paper:  Accurate FPGA Power Modeling

    White Paper: Accurate FPGA Power Modeling

    Maximizing FPGA processing and channel density in SWaP-constrained EW applications through accurate thermal modeling.

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  • Digital Conversion Module (DCM) Product Guide

    Digital Conversion Module (DCM) Product Guide

    IF Processing and Direct Conversion product family guide. These solutions enable the real-time digitization and processing of complex signals using the most advanced ADS, DAC and FPGA technology.

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  • The Next Generation of RF Engineers

    The Next Generation of RF Engineers

    Along with the warm weather and long days, summer means a new group of co-ops. Here at Mercury Systems, where innovation drives each subsequent generation of new products, we depend on our...

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  • Frequency Converters and Transceivers

    Frequency Converters and Transceivers

    Microwave and digital open-architecture transceivers in 3U and 6U form factors plus high-performance rackmount converters up to 40HGz with a 2GHz IBW

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  • Innovative RF Engineering Teams

    Innovative RF Engineering Teams

    In this series of blog posts I will explore various topics in the growing space that is the intersection of the commercial communications industry and the RF/Microwave defense industry. Gone are...

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  • Space-Qualified Microelectronics

    Space-Qualified Microelectronics

    Whether you application demands space-level reliability for RF components or storage devices, we have the design, manufacturing and test expertise to deliver the right solution.

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  • Modular RF Architectures

    Modular RF Architectures

    Let’s start with the traditional approach. After spending the morning helping production with some tuning on an amplifier, you finally start reading through the 120-page RFP, SCD, and SOW for the...

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