Tech Brief: Rugged Embedded Packaging and Next-Generation Cooling

January 28, 2020

Off-the-shelf packaging and cooling technologies for embedded aerospace and defense applications.

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Taking the Data Center to the Edge with High-Performance Embedded Edge Computing
Taking the Data Center to the Edge with High-Performance Embedded Edge Computing

Data center GPU coprocessing for aerospace and defense: High-performance computing has evolved into high-pe...

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White Paper:  High-Performance OpenVPX Forced Air-Cooling Architectures
White Paper: High-Performance OpenVPX Forced Air-Cooling Architectures

How the most innovative embedded cooling technologies compare, Embedding modern, powerful processors into r...