Off-the-shelf packaging and cooling technologies for embedded aerospace and defense applications.
Data center GPU coprocessing for aerospace and defense: High-performance computing has evolved into high-pe...
Data center GPU coprocessing for aerospace and defense: High-performance computing has evolved into high-performance embedded edge computing.
How the most innovative embedded cooling technologies compare, Embedding modern, powerful processors into rugged OpenVPX processing systems requires efficient cooling for reliable, full throttle, unre
Maximizing FPGA processing and channel density in SWaP-constrained EW applications through accurate thermal modeling.
The thermal resistances for the Plastic Ball Grid Array (PBGA) Multi Chip Packages (MCP) published in WEDC data sheets are results from thermal modeling software calculations.
As system operating frequencies increase, electronic components must dissipate more power to accommodate the needed reduction in access time. Thermal considerations become increasingly important in d