Article: Redefining Sensor Edge Processing

February 24, 2021 Erin Spring

Heterogeneous 2.5D system-in-package (SiP) technology, a new trend in microelectronics that includes multiple die inside the same package, is proving to be an excellent match for sensor-edge processing requirements, as it integrates high-performance chiplets to support direct digitization of wideband RF signals.

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Tech Brief:  Microelectronics for the Sensor Edge
Tech Brief: Microelectronics for the Sensor Edge

We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, ...

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White Paper:  Redefining Sensor Edge Processing with 2.5D System-in-Package Technology
White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine ...

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