×

Please register to view this content

First Name
Last Name
Company
Job Title
Country
State
Opt me in to receive communications from Mercury Systems
Thank you
Error - something went wrong!
   

White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

June 24, 2020

Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power.  By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.  Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.

Previous Asset
Article:  Redefining Sensor Edge Processing
Article: Redefining Sensor Edge Processing

Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge p...

Next Article
Can I Get a SOSA-Aligned Everything, Please?
Can I Get a SOSA-Aligned Everything, Please?

SOSA can provide the balance between plug-and-play and secure sustainability for multiple devices to work t...

×

Interested in our technology? Contact Sales

First Name
Last Name
Company
Country
State
Phone Number
Comments or Inquiry
Thank you, we will get back to you soon!
Error - something went wrong!