Space
Explore Mercury's space qualified technology resources to stay up to date and learn how our innovations help electronics survive radiation-intense environments and extend their lifetime.
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White Paper: Space and Beyond - Technology and the Space-based Data Chain
Learn how commercial technology companies and the aerospace and defense industry are merging their innovations to help government organizations enable on-orbit sensor fusion.
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Product Guide: Space-Qualified Solutions
Delivering open, secure, high-performance space processing solutions
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Case Study: NASA manufactures ZBLAN optical fibers in space
Learn more on Mercury and NASA manufacturing high-performance ZBLAN optical fibers in space aboard the International Space Station (ISS).
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White Paper: Protecting Satellite Image Integrity from Radiation
Today's space imaging systems require radiation-tolerant NAND flash components with advanced error correction, packaged in lightweight, rugged VPX form factors.
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Delivering high-quality and highly reliable memory products through industry partnerships
Memory solutions matter for mission-critical applications. High-quality, high-reliability and ruggedness are key for aerospace and defense industry applications. Hear how Mercury and Micron...
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Article: GaN SSPA Technology for Space-Based Applications
Few technology applications are positioned to benefit from high-power RF GaN device insertion to the extent as space payloads.
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White Paper: Xeon-D Vs Xeon-E for Embedded Radar Applications
Comparing Intel Xeon server-class processors for Space Time Adaptive Processing (STAP) applications.
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Memory and Microelectronics Technology
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White Paper: Embedded Cognitive Computing and Artificial Intelligence - Part 1
This white paper describes AI and cognitive computing (CC) and introduces the underlying largely commercially developer IP that enables them.
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Data Storage and Transfer Technology
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White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
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