Few technology applications are positioned to benefit from high-power RF GaN device insertion to the extent as space payloads. Costing roughly $10,000 per pound of payload to launch a satellite into space, the benefit of small, lightweight hardware is obvious. The trend toward low Earth orbit (LEO) satellite constellations is increasing the pressure to develop cost-saving technologies. While GaN is well-positioned to deliver these benefits, its use is not without challenges. To maximize the mean time between failures (MTBF), the thermal conduction path away from the device must be carefully designed. As an added challenge, the lack of industry heritage using GaN in space requires thorough analysis and additional qualification testing. content
Recommended
Case Study: NASA manufactures ZBLAN optical fibers in space
Learn more on Mercury and NASA manufacturing high-performance ZBLAN optical fibers in space aboard the International Space Station (ISS).
White Paper: Protecting Satellite Image Integrity from Radiation
Today's space imaging systems require radiation-tolerant NAND flash components with advanced error correction, packaged in lightweight, rugged VPX form factors.
Case Study: Mercury Supplies SSDR for NASA's JPL EMIT Science Mission
JPL required a reliable, rad-tolerant storage device with large storage capacity. Mercury delivered the RH3440 SSDR, enabling high-performance on-orbit sensor data processing and storage.
Press: Mercury’s Solid-State Data Recorders (SSDRs) Headed to Space
NASA's Jet Propulsion Laboratory selects Mercury technology for critical science mission
Whether you application demands space-level reliability for RF components or storage devices, we have the design, manufacturing and test expertise to deliver the right solution.
Delivering high-quality and highly reliable memory products through industry partnerships
Memory solutions matter for mission-critical applications. High-quality, high-reliability and ruggedness are key for aerospace and defense industry applications. Hear how Mercury and Micron...
Tech Brief: Microelectronics for the Sensor Edge
We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.
Comparing Intel Xeon server-class processors for Space Time Adaptive Processing (STAP) applications.
This white paper describes AI and cognitive computing (CC) and introduces the underlying largely commercially developer IP that enables them.
Innovation that's embedded - this brief explores's Mercury's "five S's" of secure data storage for military embedded systems: SWaP, Speed, Security, Sanitize and Self-Destruct.
Product Guide: GaN Power Amplifiers
GaN-based power amplifiers are ideal choice when your program requires high power, at high frequencies and in a small space.
White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
In order to minimize cost and time-to-market, the hardware must be flexible and modular. To address this emerging-need, we have developed a multi-channel, coherent system architecture.
An overview of Mercury’s broad RF, microwave and mixed-signal solutions including compact components and highly integrated, modular assemblies.