In the past Space Time Adaptive Processing (STAP) was a challenge for embedded systems. This white paper studies STAP processing approaches, using Xeon D and E processors for comparison.
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Orbital Edge: Space Data Processing and Storage
Space, rad-tolerant, data processing and storage solution for LEO, MEO, GEO orbits to process and collect wideband sensor data from satellites to Earth.
White Paper: Advancing Signal Data Processing Space Payloads with Micron
Learn about Mercury's data recorder solutions for sophisticated technologies to manage and analyze vast amounts of data, which is increasingly critical for defense and security operations in space.
Article: Inside Story - Interview with Vincent Pribble, Prinicipal Product Manager
In this interview, Vincent Pribble, Principal Product Manager at Mercury Systems, discusses current trends and the outlook for data recorders for space.
Delivering processing innovation for the air and space domains
Mercury’s chief operating officer, Roger Wells, sat down for an interview with Air & Space Forces Magazine to discuss the global security environment and how the Mercury Processing Platform is...
Product Guide: Space-Qualified Solutions
Delivering open, secure, high-performance space processing solutions
Case Study: NASA manufactures ZBLAN optical fibers in space
Learn more on Mercury and NASA manufacturing high-performance ZBLAN optical fibers in space aboard the International Space Station (ISS).
White Paper: Protecting Satellite Image Integrity from Radiation
Mercury's lightweight, rugged, radiation-tolerant NAND flash components are furthering space imaging missions in LEO, MEO and GEO with reliable data storage. Learn more in this white paper.
Few technology applications are positioned to benefit from high-power RF GaN device insertion to the extent as space payloads.
This white paper describes AI and cognitive computing (CC) and introduces the underlying largely commercially developer IP that enables them.
White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.