Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
This white paper describes AI and cognitive computing (CC) and introduces the underlying largely commercial...
Whether you application demands space-level reliability for RF components or storage devices, we have the design, manufacturing and test expertise to deliver the right solution.
GaN-based power amplifiers are ideal choice when your program requires high power, at high frequencies and in a small space.
This white paper describes AI and cognitive computing (CC) and introduces the underlying largely commercially developer IP that enables them.
In order to minimize cost and time-to-market, the hardware must be flexible and modular. To address this emerging-need, we have developed a multi-channel, coherent system architecture.
An overview of Mercury’s broad RF, microwave and mixed-signal solutions including compact components and highly integrated, modular assemblies.