Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
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This white paper describes AI and cognitive computing (CC) and introduces the underlying largely commercial...
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Learn more on Mercury and NASA manufacturing high-performance ZBLAN optical fibers in space aboard the International Space Station (ISS).
Today's space imaging systems require radiation-tolerant NAND flash components with advanced error correction, packaged in lightweight, rugged VPX form factors.
Whether you application demands space-level reliability for RF components or storage devices, we have the design, manufacturing and test expertise to deliver the right solution.
Memory solutions matter for mission-critical applications. High-quality, high-reliability and ruggedness are key for aerospace and defense industry applications. Hear how Mercury and Micron...
Few technology applications are positioned to benefit from high-power RF GaN device insertion to the extent as space payloads.
Comparing Intel Xeon server-class processors for Space Time Adaptive Processing (STAP) applications.
This white paper describes AI and cognitive computing (CC) and introduces the underlying largely commercially developer IP that enables them.
An overview of Mercury’s broad RF, microwave and mixed-signal solutions including compact components and highly integrated, modular assemblies.