Huge numbers of image pixels and very small orbiting platforms are driving the demand for major improvements in future space-based data storage. Satellite designers need solutions that provide vastly more capacity while being smaller, lighter and able to operate reliably for years in a high-radiation environment.
Learn more on Mercury and NASA manufacturing high-performance ZBLAN optical fibers in space aboard the Inte...
Learn more on Mercury and NASA manufacturing high-performance ZBLAN optical fibers in space aboard the International Space Station (ISS).
JPL required a reliable, rad-tolerant storage device with large storage capacity. Mercury delivered the RH3440 SSDR, enabling high-performance on-orbit sensor data processing and storage.
NASA's Jet Propulsion Laboratory selects Mercury technology for critical science mission
Whether you application demands space-level reliability for RF components or storage devices, we have the design, manufacturing and test expertise to deliver the right solution.
Memory solutions matter for mission-critical applications. High-quality, high-reliability and ruggedness are key for aerospace and defense industry applications. Hear how Mercury and Micron...
Few technology applications are positioned to benefit from high-power RF GaN device insertion to the extent as space payloads.
We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.
Comparing Intel Xeon server-class processors for Space Time Adaptive Processing (STAP) applications.
This white paper describes AI and cognitive computing (CC) and introduces the underlying largely commercially developer IP that enables them.
Innovation that's embedded - this brief explores's Mercury's "five S's" of secure data storage for military embedded systems: SWaP, Speed, Security, Sanitize and Self-Destruct.
GaN-based power amplifiers are ideal choice when your program requires high power, at high frequencies and in a small space.
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
In order to minimize cost and time-to-market, the hardware must be flexible and modular. To address this emerging-need, we have developed a multi-channel, coherent system architecture.
An overview of Mercury’s broad RF, microwave and mixed-signal solutions including compact components and highly integrated, modular assemblies.