Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge p...
Using technologies like high-bandwidth memory, high-bit-rate optical interfaces and gigabit serial protocols to address processing and memory demands in modern military systems
Military Embedded Systems Deep Dive Podcast: Mercury Systems' FPGA single-board computers, data-acquisition boards, recording systems, and other products for radar, signals intelligence (SIGINT)
It’s finally here. Trusted, onshore 2.5D custom microelectronics. Listen as Tom Smelker, VP and general manager, Microsystems, discusses Mercury’s collaboration with semiconductor partners to...
An overview of Mercury’s broad RF, microwave and mixed-signal solutions including compact components and highly integrated, modular assemblies.
From the proliferation of smart phones to the introduction of self-driving cars, the last decade has brought sweeping technological advances across all industries.
In order to minimize cost and time-to-market, the hardware must be flexible and modular. To address this emerging-need, we have developed a multi-channel, coherent system architecture.
Microwave Journal: Optimize the IF from mission to mission
We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.
To address emerging electronic warfare (EW) threats, which are becoming increasingly more agile and moving up the spectrum, radio frequency (RF) and microwave component designs are also evolving.
SOSA can provide the balance between plug-and-play and secure sustainability for multiple devices to work together seamlessly. This new technology architecture can save time, reduce SWaP, and...
Developing a precision-guided capability small enough to fit into a munition that weighs less than 0.1% of a cruise missile, all for a fraction of the cost.
GaN-based power amplifiers are ideal choice when your program requires high power, at high frequencies and in a small space.
Maximizing FPGA processing and channel density in SWaP-constrained EW applications through accurate thermal modeling.
IF Processing and Direct Conversion product family guide. These solutions enable the real-time digitization and processing of complex signals using the most advanced ADS, DAC and FPGA technology.
Along with the warm weather and long days, summer means a new group of co-ops. Here at Mercury Systems, where innovation drives each subsequent generation of new products, we depend on our...
Microwave and digital open-architecture transceivers in 3U and 6U form factors plus high-performance rackmount converters up to 40HGz with a 2GHz IBW
In this series of blog posts I will explore various topics in the growing space that is the intersection of the commercial communications industry and the RF/Microwave defense industry. Gone are...
Whether you application demands space-level reliability for RF components or storage devices, we have the design, manufacturing and test expertise to deliver the right solution.
Let’s start with the traditional approach. After spending the morning helping production with some tuning on an amplifier, you finally start reading through the 120-page RFP, SCD, and SOW for the...