Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
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1:01Sam Ceccola, HPE's DoD CTO, speaks about how Mercury Systems' RES-XR6 Alliance rugged, high-performance servers bring the performance of HPE's server platforms to the harshest military environments.
2:21Mercury's rugged edge servers accelerate Artificial Intelligence (AI), Cybersecurity, Signals Intelligence (SIGINT) and C4ISR tactical edge computing workloads.
Our approach to building products for enhanced durability under extreme environmental conditions, including repeated temperature cycling over wide temperature ranges.
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Mercury Systems is a next-generation defense electronics company making commercial technologies profoundly more accessible to aerospace and defense. Watch the interactive virtual conversation with...
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Learn about the trends, requirements, and limitations of Defense Fog and Edge Computing. Our blog post compares fog and edge processing layer resources in commercial and defense markets
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NAND flash, packaged as a Solid State Drives (SSD), are now a common component in defense equipment. Add security and SSDs become the ideal big-data secure storage solution for defense application.