White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

June 24, 2020

Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power.  By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.  Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.

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White Paper:  Safe guarding Mission Critical Data with Secure Solid State Drives
White Paper: Safe guarding Mission Critical Data with Secure Solid State Drives

NAND flash, packaged as a Solid State Drives (SSD), are now a common component in defense equipment. Add se...

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White Paper:  Demystifying Hardware Full Disk Encryption Technology for Military Data Storage
White Paper: Demystifying Hardware Full Disk Encryption Technology for Military Data Storage

Maximum protection, and full compliance with CSfC program guidelines, can only be achieved with proven dive...

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