Webinar: Exploring the advantages of chip-scale vs SMT integration for high-speed processing modules

June 1, 2023 Kelsey Ryon

The performance of modern edge processing solutions is becoming limited by traditional design methodologies. Join Mercury Systems as they discuss the technologies and processes required to deliver leading performance at chip scale. Leveraging cross-industry partnerships, integration at chip scale with leading edge memory & Storage results in advanced packaged solutions that offer unparalleled space savings, processing capability, and more.

Jennifer Keenan is the Sr. Prin. Product Manager for the Microelectronics Advanced Packaging group of Mercury Systems in Phoenix, Arizona. As part of the Microsystems team, Jennifer is driving the heterogenous integrated system-in-package roadmap delivering SWAP-optimized, trusted and rugged signal processing solutions to aerospace and defense. Prior to Mercury, Jennifer worked 15+ years in product management, product marketing and supply management in the embedded computing businesses of Motorola and Hemisphere GNSS. She received her Bachelor of Science degree in Marketing and Supply Management from Florida State University in Tallahassee, Florida.

Previous Article
Webinar:  Bringing AI to the tactical edge with AMD Versal™ ACAP
Webinar: Bringing AI to the tactical edge with AMD Versal™ ACAP

AMD and Mercury are working together to deliver up to 20× more processing power closer to the edge. Join ou...

Next Article
Webinar: Choosing the Right FPGA for your Application
Webinar: Choosing the Right FPGA for your Application

This webinar examines performance characteristics with an eye towards the best match for processing and hig...