Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
This paper first discusses advanced capabilities that enhance LCD technology and then reviews business fact...
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This paper first discusses advanced capabilities that enhance LCD technology and then reviews business factors to consider when selecting or specifying display systems.
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.
This paper investigates both the large area display architecture with available options to solve redundancy, as well as, beam steering techniques to limit canopy reflections in bubble canopy cockpits.
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Comparing Intel Xeon server-class processors for Space Time Adaptive Processing (STAP) applications.
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Mercury, contracted by Airbus D&S is supplying processing subsystems as part of the EGNOS common computing platform.
The real-time processing of data requires fastest FPGA devices and multicore processors. These devices cannot provide peak performance without highly dense and high-speed DDR4 and DDR5 memory.