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Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

June 24, 2020

Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power.  By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.  Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.

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Selecting Optimal Avionic and Vetronic Displays for Your Application
Selecting Optimal Avionic and Vetronic Displays for Your Application

This paper first discusses advanced capabilities that enhance LCD technology and then reviews business fact...

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Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)
Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)

At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facili...