Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
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Selecting Optimal Avionic and Vetronic Displays for Your Application
This paper first discusses advanced capabilities that enhance LCD technology and then reviews business factors to consider when selecting or specifying display systems.
Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.
This paper investigates both the large area display architecture with available options to solve redundancy, as well as, beam steering techniques to limit canopy reflections in bubble canopy cockpits.
Today’s Electronic Warfare, and EW subsets that include Electronic Attack (EA), Electronic Protection (EP) and Electronic Support (ES) are critical to holding a strategic advantage.
Accurate FPGA Power Modeling
Maximizing FPGA processing and channel density in SWaP-constrained EW applications through accurate thermal modeling.
High-performance OpenVPX Forced Air-cooling Architectures
How the most innovative embedded cooling technologies compare, Embedding modern, powerful processors into rugged OpenVPX processing systems requires efficient cooling for reliable, full throttle, unre
Enabling big processing & AI-powered everything, everywhere
Scaling and deploying composable data center capabilities across the fog and edge layers with high performance embedded edge computing (HPEEC).
Comparing Intel Xeon server-class processors for Space Time Adaptive Processing (STAP) applications.
How to affordably decrease safety critical processing subsystem development time and program risk using DO-178 / DO-254 certifiable off-the-shelf building blocks.
Mercury, contracted by Airbus D&S is supplying processing subsystems as part of the EGNOS common computing platform.
The real-time processing of data requires fastest FPGA devices and multicore processors. These devices cannot provide peak performance without highly dense and high-speed DDR4 and DDR5 memory.
This white paper describes AI and cognitive computing (CC) and introduces the underlying largely commercially developer IP that enables them.
This white paper describes the contemporary challenges facing all airborne integrators as they leverage next generation technology for airborne mission critical operations.
Learn how commercial open computing strategies used by social media giants and advanced manufacturing practices employed by the automotive and logistics industries can be leveraged by the Navy.
Commercial digital convergence has created converged media, information systems, smartphones and autonomous vehicles. Digital convergence now has a proven roadmap behind it and is enabling...
NAND flash, packaged as a Solid State Drives (SSD), are now a common component in defense equipment. Add security and SSDs become the ideal big-data secure storage solution for defense application.
Maximum protection, and full compliance with CSfC program guidelines, can only be achieved with proven diversity in the selection of security components.
Mercury Systems has pioneered a next generation defense electronics business model and supporting manufacturing infrastructure that addresses globalized supply chains.
Only by understanding the mechanics of the various key management mode methodologies can the military system architect choose the optimal strategy for each mission or program.
Developing a precision-guided capability small enough to fit into a munition that weighs less than 0.1% of a cruise missile, all for a fraction of the cost.