Heterogeneous 2.5D system-in-package (SiP) technology, a new trend in microelectronics that includes multiple die inside the same package, is proving to be an excellent match for sensor-edge processing requirements, as it integrates high-performance chiplets to support direct digitization of wideband RF signals.
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Mercury Systems is a next-generation defense electronics company making commercial technologies profoundly more accessible to aerospace and defense. Watch the interactive virtual conversation with...
Securing Our Domestic Supply Chain
Now more than ever, we must address the entire ecosystem to build and sustain a robust and resilient domestic defense supply chain for decades to come—including investing in companies providing...
Finding New Supply Chain Muscles in a COVID-19 World
While I’ve tried to refrain from using the new cliché “these are unprecedented times,” I cannot think of a better way to describe what we are facing with COVID-19. Like the other functions within...
Mercury Systems has pioneered a next generation defense electronics business model and supporting manufacturing infrastructure that addresses globalized supply chains.
There is a gap within the community for reliable providers of secure, scalable and affordable subsystems that can support critical programs. Learn how we fill this gap with our "built-in" security.