The artificial intelligence (AI) revolution is profoundly influencing all manners of human endeavor and has the potential to shift the global balance of power. It is therefore a priority to develop...
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Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.
This paper investigates both the large area display architecture with available options to solve redundancy, as well as, beam steering techniques to limit canopy reflections in bubble canopy cockpits.
Today’s Electronic Warfare, and EW subsets that include Electronic Attack (EA), Electronic Protection (EP) and Electronic Support (ES) are critical to holding a strategic advantage.
Accurate FPGA Power Modeling
Maximizing FPGA processing and channel density in SWaP-constrained EW applications through accurate thermal modeling
High-performance OpenVPX Forced Air-cooling Architectures
How the most innovative embedded cooling technologies compare.
Enabling big processing & AI-powered everything, everywhere
Introducing the technologies developed by Mercury Systems & Intel that enable the best commercial data center processing capabilities to migrate across smarter fog and edge layers.
How to affordably decrease safety critical processing subsystem development time and program risk using DO-178 / DO-254 certifiable off-the-shelf building blocks.
Mercury, contracted by Airbus D&S is supplying processing subsystems as part of the EGNOS common computing platform.
The real-time processing of data requires fastest FPGA devices and multicore processors. These devices cannot provide peak performance without highly dense and high-speed DDR4 and DDR5 memory.
This white paper describes the contemporary challenges facing all airborne integrators as they leverage next generation technology for airborne mission critical operations.
Learn how commercial open computing strategies used by social media giants and advanced manufacturing practices employed by the automotive and logistics industries can be leveraged by the Navy.
Military digital transformation enables platforms to shrink and become more capable and adaptable for mission autonomy.
We discuss our proposal for a new microelectronics packaging platform addressing the practical needs of the defense market for the 21st century.
NAND flash, packaged as a Solid State Drives (SSD), are now a common component in defense equipment. Add security and SSDs become the ideal big-data secure storage solution for defense application.
Maximum protection, and full compliance with CSfC program guidelines, can only be achieved with proven diversity in the selection of security components.
This white paper answers a national defense imperative, "How do we put technology into the hands of our soldiers faster."
Only by understanding the mechanics of the various key management mode methodologies can the military system architect choose the optimal strategy for each mission or program.
Developing a precision-guided capability small enough to fit into a munition that weighs less than 0.1% of a cruise missile, all for a fraction of the cost.