Next-generation defense and aerospace applications are smarter and increasingly more autonomous. To be trusted and deployable anywhere, they require both proven systems security engineering (SSE) and the assurance of flight-safety certification. This whitepaper discusses the challenges and evolving methods of combining the often-competing but equally required assurance of private SSE and “public” flight-safety certification that is enabling modern processing systems to be deployed anywhere.
PCIe Gen 4 technologies increase application efficiency by eliminating bottlenecks and increasing throughpu...
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Optimized to solve the most advanced radar, cognitive EW and AI challenges, learn how Mercury ’s ACAP-engineer-to-engineer designer’s journey is intended to assist other development teams as they
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SWaP-optimized and ruggedized for operation in harsh environments, learn how Mercury ’s ACAP-based solutions will bring new levels of application capability to the tactical edge.
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Assurance of DAL flight-safety certification and systems security engineering (SSE) is required to protect systems and mitigate risk for future smart and autonomous platforms
Discover how technologies developed by Mercury Systems and NVIDIA scale the best AI-enabling data center processing capabilities to the edge for real-time decision-making.
Cloud-scalable cross-domain solution methodologies, challenges and implementations for rapid, secure and correct information transfer between multiple security domains.
Modern sensors and AI need powerful flight-ready computing, but creating safe multi-core processing systems is difficult to achieve. Learn why Intel-based solutions are suited for AI and FVL.
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Artificial Intelligence (AI) is rapidly transforming the defense industry by broadening the scope of machine applications and leveling the playing field for nation states looking to gain power.
Enterprises supporting the DoD can leverage commercial investment, open systems architectures and internal R&D to speed technology innovation and reduce overall sustainment and investment cost.
Rappid: A modular, application-ready spectrum processing platform
PCIe Gen 4 technologies increase application efficiency by eliminating bottlenecks and increasing throughput for multi-domain, compute-intensive applications at the edge.
This paper first discusses advanced capabilities that enhance LCD technology and then reviews business factors to consider when selecting or specifying display systems.
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
Technology is evolving faster than ever. Mercury's business model leverages open standards, commercial technology and R&D investment to drive innovation at a lower cost.
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.