Rappid: A modular, application-ready spectrum processing platform
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Learn how Mercury builds products with varying degrees of enhanced durability to operate under extreme environmental conditions, including repeated temperature cycling over wide temperature ranges.
Learn how Mercury and Intel collaborate to scale and deploy composable data center capabilities across the fog and edge layers with high performance embedded computing (HPEC)
Assurance of DAL flight-safety certification and systems security engineering (SSE) is required to protect systems and mitigate risk for future smart and autonomous platforms
Discover how technologies developed by Mercury Systems and NVIDIA scale the best AI-enabling data center processing capabilities to the edge for real-time decision-making.
Cloud-scalable cross-domain solution methodologies, challenges and implementations for rapid, secure and correct information transfer between multiple security domains.
Modern sensors and AI need powerful flight-ready computing, but creating safe multi-core processing systems is difficult to achieve. Learn why Intel-based solutions are suited for AI and FVL.
Today's space imaging systems require radiation-tolerant NAND flash components with advanced error correction, packaged in lightweight, rugged VPX form factors.
Artificial Intelligence (AI) is rapidly transforming the defense industry by broadening the scope of machine applications and leveling the playing field for nation states looking to gain power.
PCIe Gen 4 technologies increase application efficiency by eliminating bottlenecks and increasing throughput for multi-domain, compute-intensive applications at the edge.
This whitepaper discusses how new holistic systems security engineering and flight-safety certification design approaches are enabling smarter platforms to be deployed anywhere.
This paper first discusses advanced capabilities that enhance LCD technology and then reviews business factors to consider when selecting or specifying display systems.
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.
This paper investigates both the large area display architecture with available options to solve redundancy, as well as, beam steering techniques to limit canopy reflections in bubble canopy cockpits.
Today’s Electronic Warfare, and EW subsets that include Electronic Attack (EA), Electronic Protection (EP) and Electronic Support (ES) are critical to holding a strategic advantage.
Maximizing FPGA processing and channel density in SWaP-constrained EW applications through accurate thermal modeling.
How the most innovative embedded cooling technologies compare, Embedding modern, powerful processors into rugged OpenVPX processing systems requires efficient cooling for reliable, full throttle, unre
Comparing Intel Xeon server-class processors for Space Time Adaptive Processing (STAP) applications.
How to affordably decrease safety critical processing subsystem development time and program risk using DO-178 / DO-254 certifiable off-the-shelf building blocks.