Previous Asset
Military-Grade Microelectronics Packaging for the 21st Century
Military-Grade Microelectronics Packaging for the 21st Century

We discuss our proposal for a new microelectronics packaging platform addressing the practical needs of the...

Next Asset
Stacked, high-speed DDR4 and DDR5 memory
Stacked, high-speed DDR4 and DDR5 memory

To handle extreme workload, system architects must design boards using the fastest FPGA devices & Intel mul...