Article: Redefining Sensor Edge Processing

February 24, 2021 Erin Spring

Heterogeneous 2.5D system-in-package (SiP) technology, a new trend in microelectronics that includes multiple die inside the same package, is proving to be an excellent match for sensor-edge processing requirements, as it integrates high-performance chiplets to support direct digitization of wideband RF signals.

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Video:  Learn about Mercury's industry leading capabilities in 2.5D SiP microelectronics
Video: Learn about Mercury's industry leading capabilities in 2.5D SiP microelectronics

Bringing trust and supply chain security to the latest commercial semiconductor solutions requires innovati...

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Webinar:  Accelerating Defense Microelectronics Through Our Digital Transformation
Webinar: Accelerating Defense Microelectronics Through Our Digital Transformation

In this webinar, we discuss four decades of innovative 2D and 2.5D microelectronics packaging and integrati...