Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
The Department of Defense has shifted priorities as new threats emerge and the U.S. seeks to secure innovative solutions, placing advanced microelectronics at the forefront of its agenda.
Mercury Systems is a next-generation defense electronics company making commercial technologies profoundly more accessible to aerospace and defense. Watch the interactive virtual conversation with...
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.
As the Pentagon continues to make microelectronics modernization a number-one priority in light of COVID-19, Mercury Systems CEO Mark Aslett shares his thoughts about the importance of addressing...
As technology scales, traditional AI processing in facilities away from the battlefield is no longer a solution. Mercury Systems is using new 2.5D SiP technology to enable edge processing...
Presenting leaders from around the world & their perspective on the state of global security. Featuring our own Mark Aslett who shares his thoughts around “Microelectronics for a new global landscape"
Our latest innovation is game-changing. Our proven microelectronics and trusted manufacturing processes when applied to chiplets will bring cutting-edge commercial silicon technology to the DOD.
Developing a precision-guided capability small enough to fit into a munition that weighs less than 0.1% of a cruise missile, all for a fraction of the cost.