White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

June 24, 2020

Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power.  By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.  Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.

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Tech Brief:  Microelectronics for the Sensor Edge
Tech Brief: Microelectronics for the Sensor Edge

We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, ...

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White Paper:  Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)
White Paper: Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)

At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facili...