Microelectronics

COTS Software Defined Radio for 5G Development

Xilinx's new RFSoC brings a powerful and unique solution for addressing some of the most demanding requirements of high bandwidth and high channel count systems.

Development Tactics and Techniques for Small Form Factor RF Signal Recorders

Recording solutions accelerate system development, performance and deployment. Capturing RF signals with precise timing over long sessions is both a necessity and a challenge for success.

Optimized to solve the most advanced radar, cognitive EW and AI challenges, learn how Mercury ’s ACAP-engineer-to-engineer designer’s journey is intended to assist other development teams as they

Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.

Our latest innovation is game-changing. Our proven microelectronics and trusted manufacturing processes when applied to chiplets will bring cutting-edge commercial silicon technology to the DOD.

We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.

By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.

At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.