Microelectronics

Learn about ACAP technology and how it's contributing to faster, stronger and more capable systems at the tactical edge.

A flexible design approach integrates individual intellectual property (IP) blocks called chiplets. The IP in a chiplet performs a specific function.

Optimized to solve the most advanced radar, cognitive EW and AI challenges, learn how Mercury ’s ACAP-engineer-to-engineer designer’s journey is intended to assist other development teams.

SWaP-optimized and ruggedized for operation in harsh environments, learn how Mercury ’s ACAP-based solutions will bring new levels of application capability to the tactical edge.

COTS Software Defined Radio for 5G Development

Xilinx's new RFSoC brings a powerful and unique solution for addressing some of the most demanding requirements of high bandwidth and high channel count systems.

Development Tactics and Techniques for Small Form Factor RF Signal Recorders

Recording solutions accelerate system development, performance and deployment. Capturing RF signals with precise timing over long sessions is both a necessity and a challenge for success.

Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.

Our latest innovation is game-changing. Our proven microelectronics and trusted manufacturing processes when applied to chiplets will bring cutting-edge commercial silicon technology to the DOD.

We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.