Microelectronics
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White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.
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Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.
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Read ArticleA New Paradigm for Defense-Grade Advanced Microelectronics
The Department of Defense has shifted priorities as new threats emerge and the U.S. seeks to secure innovative solutions, placing advanced microelectronics at the forefront of its agenda.
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Next-Generation Custom Microelectronics Infographic
Our latest innovation is game-changing. Our proven microelectronics and trusted manufacturing processes when applied to chiplets will bring cutting-edge commercial silicon technology to the DOD.
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Read ArticleEnabling a Trusted Domestic Microelectronics Ecosystem
Mercury Systems is a next-generation defense electronics company making commercial technologies profoundly more accessible to aerospace and defense. Watch the interactive virtual conversation with...
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Read NowArticle: Redefining Sensor Edge Processing
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.
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Read ArticleA Trusted and Secure Ecosystem for Microelectronics
As the Pentagon continues to make microelectronics modernization a number-one priority in light of COVID-19, Mercury Systems CEO Mark Aslett shares his thoughts about the importance of addressing...
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Read ArticleLeading the Way With Edge Processing
As technology scales, traditional AI processing in facilities away from the battlefield is no longer a solution. Mercury Systems is using new 2.5D SiP technology to enable edge processing...
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A Novel RF and Digital Microelectronics Architecture for Precision Guided Weapons
Developing a precision-guided capability small enough to fit into a munition that weighs less than 0.1% of a cruise missile, all for a fraction of the cost.
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