Microelectronics

  • Video Interview: Revving Up the Sensor Open Systems Architecture Edition 2.0

    Video Interview: Revving Up the Sensor Open Systems Architecture Edition 2.0

    Mercury Systems' Rodger Hosking talks to Electronic Design's Bill Wong about the latest SOSA initiative and the company's 5560 Versal HBM ACAP Coprocessor SOSA-compliant board.

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  • What's the big deal with ACAP technology?

    What's the big deal with ACAP technology?

    Learn about ACAP technology and how it's contributing to faster, stronger and more capable systems at the tactical edge.

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  • Revolutionizing microelectronics with chipletized architectures

    Revolutionizing microelectronics with chipletized architectures

    A flexible design approach integrates individual intellectual property (IP) blocks called chiplets. The IP in a chiplet performs a specific function.

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  • Delivering RF signal processing solutions to the edge with MOSA

    Delivering RF signal processing solutions to the edge with MOSA

    Today's pace of technology development means the traditional approach of custom-designed modules and subsystems is too slow, but Modular Open System Architecture (MOSA) approaches can deliver on...

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  • White Paper: Designer's Journey: Navigating the Transition to Versal ACAP

    White Paper: Designer's Journey: Navigating the Transition to Versal ACAP

    Optimized to solve the most advanced radar, cognitive EW and AI challenges, learn how Mercury ’s ACAP-engineer-to-engineer designer’s journey is intended to assist other development teams.

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  • White Paper: A Generational Leap in Edge Computing with the Versal ACAP

    White Paper: A Generational Leap in Edge Computing with the Versal ACAP

    SWaP-optimized and ruggedized for operation in harsh environments, learn how Mercury ’s ACAP-based solutions will bring new levels of application capability to the tactical edge.

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  • Webinar: The Future of Military Radar Online Panel

    Webinar: The Future of Military Radar Online Panel

    Online panel discussions regarding the future of radar in the defense community.

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  • White Paper: COTS Software Defined Radio for 5G Development

    White Paper: COTS Software Defined Radio for 5G Development

    COTS Software Defined Radio for 5G Development

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  • White Paper: Strategies for Deploying Xilinx’s Zynq UltraScale+ RFSoC

    White Paper: Strategies for Deploying Xilinx’s Zynq UltraScale+ RFSoC

    Xilinx's new RFSoC brings a powerful and unique solution for addressing some of the most demanding requirements of high bandwidth and high channel count systems.

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  • White Paper: Development Tactics & Techniques For Small Form Factor RF Signal Recorders

    White Paper: Development Tactics & Techniques For Small Form Factor RF Signal Recorders

    Development Tactics and Techniques for Small Form Factor RF Signal Recorders

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  • Tech Brief: Expedite Critical Wideband Signal Recorders in Defense Applications

    Tech Brief: Expedite Critical Wideband Signal Recorders in Defense Applications

    Recording solutions accelerate system development, performance and deployment. Capturing RF signals with precise timing over long sessions is both a necessity and a challenge for success.

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  • Webinar: Technology advancements in data storage and system interfaces for high-speed data recording

    Webinar: Technology advancements in data storage and system interfaces for high-speed data recording

    Use the latest technology that allow real-time recording systems to keep up with the ever-increasing speed requirements of wide-bandwidth data capture in modern military systems.

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  • Webinar: Solving High-Bandwidth Data Transfer and Memory Access in Data Converter Systems

    Webinar: Solving High-Bandwidth Data Transfer and Memory Access in Data Converter Systems

    Using technologies like high-bandwidth memory, high-bit-rate optical interfaces and gigabit serial protocols to address processing and memory demands in modern military systems

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  • Video:  Learn about Mercury's industry leading capabilities in 2.5D SiP microelectronics1:19

    Video: Learn about Mercury's industry leading capabilities in 2.5D SiP microelectronics

    Bringing trust and supply chain security to the latest commercial semiconductor solutions requires innovation at chip scale. High density 2.5D system-in-package technology solves industry challenges.

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  • Article:  Redefining Sensor Edge Processing

    Article: Redefining Sensor Edge Processing

    Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.

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  • Webinar:  Accelerating Defense Microelectronics Through Our Digital Transformation

    Webinar: Accelerating Defense Microelectronics Through Our Digital Transformation

    In this webinar, we discuss four decades of innovative 2D and 2.5D microelectronics packaging and integration, then review the latest trends in microelectronics.

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  • Enabling a Trusted Domestic Microelectronics Ecosystem

    Enabling a Trusted Domestic Microelectronics Ecosystem

    Mercury Systems is a next-generation defense electronics company making commercial technologies profoundly more accessible to aerospace and defense. Watch the interactive virtual conversation with...

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  • Next-Generation Custom Microelectronics Infographic

    Next-Generation Custom Microelectronics Infographic

    Our latest innovation is game-changing. Our proven microelectronics and trusted manufacturing processes when applied to chiplets will bring cutting-edge commercial silicon technology to the DOD.

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  • Tech Brief:  Microelectronics for the Sensor Edge

    Tech Brief: Microelectronics for the Sensor Edge

    We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.

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  • Podcast: Microelectronics Supply

    Podcast: Microelectronics Supply

    In this episode, podcast host Ken Miller sits with Dr. William Conley, Chief Technology Officer and discuss how Microelectronics holds significant importance to EMSO.

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