×

Register now for complete access to all Resource Hub content!

First Name
Last Name
Company
Job Title
Country
State
Opt me in to receive communications from Mercury Systems
Thank you!
Error - something went wrong!
   

Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

June 24, 2020

Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power.  By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.  Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.

No Previous Asset

Next Asset
High Density Secure Memory Tech Brief
High Density Secure Memory Tech Brief

This technical brief examines Mercury's portfolio of High Density Secure Memory products, a unique offering...