Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
The thermal resistances for the Plastic Ball Grid Array (PBGA) Multi Chip Packages (MCP) publ...
High-quality, high-reliability and ruggedness are key for A&D industry applications. Hear how Mercury and Micron partner to deliver trusted memory modules across extreme environments.
In this webinar, discover how to address memory design challenges at the sensor edge with modern packaging techniques that help avoid system performance limitations and other development imperatives.
Processing large volumes of data in rugged environments away from climate-controlled data centers requires compact and dependable memory solutions.
Compact and rugged DDR memory components for SWaP-constrained applications
We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking integration, leading semiconductor manufacturers, and trusted manufacturing in harsh environments.
Explore our portfolio of rugged, high-density DDR, SSRAM and NOR Flash memory products with our quick reference guide detailing the size, organization, data rate and more.
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.
This technical brief examines Mercury's portfolio of High Density Secure Memory products, a unique offering delivering high-speed, military-hardened memory solutions in small form factors.
The thermal resistances for the Plastic Ball Grid Array (PBGA) Multi Chip Packages (MCP) published in WEDC data sheets are results from thermal modeling software calculations.
The real-time processing of data requires fastest FPGA devices and multicore processors. These devices cannot provide peak performance without highly dense and high-speed DDR4 and DDR5 memory.
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.
To handle extreme workload, system architects must design boards using the fastest FPGA devices & Intel multicore processors. These devices cannot provide peak performance with high-speed DDR4 memory.
Whether you application demands space-level reliability for RF components or storage devices, we have the design, manufacturing and test expertise to deliver the right solution.
Edge processing architectures in today’s autonomous and AI military systems, process an ever growing amount of sensor data. Many of these systems or devices used for edge processing applications...
Don’t believe what they say…Size DOES Matter! In this case the smaller the better – especially in the constrained spaces of an aircraft cockpit or an unmanned vehicle where every inch is precious...