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White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

June 24, 2020

Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power.  By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security.  Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.

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Application Note:  PBGA Thermal Resistance Correlation
Application Note: PBGA Thermal Resistance Correlation

The thermal resistances for the Plastic Ball Grid Array (PBGA) Multi Chip Packages (MCP) publ...

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White Paper:  Enabling Edge Processing with Stacked, High-Speed DDR4 and DDR5 Memory
White Paper: Enabling Edge Processing with Stacked, High-Speed DDR4 and DDR5 Memory

The real-time processing of data requires fastest FPGA devices and multicore processors. These devices cann...