Advancements in microelectronics technology now provide a new approach to overcoming trade-offs between physical size and processing power. By working at the chip level and leveraging new 2.5D system-in-package (SiP) capabilities, designers can combine complex semiconductor dies into a single component while maintaining trust and security. Compared to a monolithic solution, where all functionality occurs on one type of silicon, heterogeneous SiP technology enables each functional block to be individually optimized.
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge p...
In this webinar, discover how to address memory design challenges at the sensor edge with modern packaging techniques that help avoid system performance limitations and other development imperatives.
Processing large volumes of data in rugged environments away from climate-controlled data centers requires compact and dependable memory solutions.
Compact and rugged DDR memory components for SWaP-constrained applications
From military-grade SSDs to dense DDR, NOR Flash memory, and more, our guide will help you select the right products for your systems.
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for sensor-edge processing requirements, integrating high-performance chiplets to support direct digitization.
This technical brief examines Mercury's portfolio of High Density Secure Memory products, a unique offering delivering high-speed, military-hardened memory solutions in small form factors.
The real-time processing of data requires fastest FPGA devices and multicore processors. These devices cannot provide peak performance without highly dense and high-speed DDR4 and DDR5 memory.
Whether you application demands space-level reliability for RF components or storage devices, we have the design, manufacturing and test expertise to deliver the right solution.
To handle extreme workload, system architects must design boards using the fastest FPGA devices & Intel multicore processors. These devices cannot provide peak performance with high-speed DDR4 memory.
The thermal resistances for the Plastic Ball Grid Array (PBGA) Multi Chip Packages (MCP) published in WEDC data sheets are results from thermal modeling software calculations.
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs facilitate the vertical integration of multiple die.
Edge processing architectures in today’s autonomous and AI military systems, process an ever growing amount of sensor data. Many of these systems or devices used for edge processing applications...
Don’t believe what they say…Size DOES Matter! In this case the smaller the better – especially in the constrained spaces of an aircraft cockpit or an unmanned vehicle where every inch is precious...
Mercury Systems specializes in three-dimensional packaging of commercial memory technologies to produce military-grade, high reliability high density secure memory solutions. Designed and manufacture