Enabling edge processing with stacked, high-speed DDR4 and DDR5 memory

In military environments, seconds can be the difference between mission success or failure and life or death. System malfunction or failure due to poor signal integrity within integrated circuits and embedded board designs leads to catastrophic events. 

The problems are stacking up

The complexity of die stacking and wire bonding increases with each additional die needed to design high-density memory, such as a single 16GB DDR4 device or a custom multi-chip module (MCM) device. With so many circuits in a tightly stacked configuration, signal integrity is at the forefront of design considerations. 

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Next Generation Airborne Video Servers
Next Generation Airborne Video Servers

This white paper describes the contemporary challenges facing all airborne integrators as they leverage nex...

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Understanding DO-254 and solutions to facilitate compliance
Understanding DO-254 and solutions to facilitate compliance

DO-254 is a document developed under the guidance of the RTCA that establishes "Design Assurance Guidance f...