Microelectronic Components
Trusted system-in-package solutions, high-density memory and secure SSDs optimized for the edge.
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Trusted system-in-package solutions, high-density memory and secure SSDs optimized for the edge.
With the increasing need for more data to be processed at the sensor for rapid decision-making, modern commercial and defense applications require high-density, high-performance microelectronics solutions in small form factors.
Our compact, ruggedized military-grade microelectronics overcome size, weight and power challenges with low-latency processing and significant space savings for operation in harsh environments at the tactical edge.
TRUSTED MICROELECTRONICS
The power of our game-changing chiplet technology, coupled with our next-generation trusted microelectronics capabilities, provides up to 75% reduction in lead time, thousands of customizable configurations and reliable performance.
This white paper focuses on a dynamic new answer to the RF edge processing challenge, an adaptation...
Using technologies like high-bandwidth memory, high-bit-rate optical interfaces and gigabit serial...
Bringing trust and supply chain security to the latest commercial semiconductor solutions requires...
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for...
Contact us to see how we can solve your mission-critical challenges