System-in-package solutions, memory and solid-state drives purpose-built for operation at the edge
With the increasing need for more data to be processed at the sensor for rapid decision-making, modern commercial and defense applications require high-density, high-performance microelectronics in small form factors.
Our compact, ruggedized microelectronics overcome size, weight and power challenges with low-latency processing and significant space savings for operation in harsh environments at the tactical edge.
MICROELECTRONIC COMPONENTS
System-in-Package & Multi-Chip Modules
Accelerate edge computing deployment with system-in-packaging and multi-chip module technologies
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Memory
Solve size, weight and power (SWaP) challenges with high-density memory in a low-profile package
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Solid-State Drives
Protect mission-critical data with highly secure, military-grade solid-state drives
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TRUSTED MICROELECTRONICS
Fast, Flexible and Built for Purpose
The power of our game-changing chiplet technology, coupled with our next-generation trusted microelectronics capabilities, provides up to 75% reduction in lead time, thousands of customizable configurations and reliable performance.