Microelectronic Components
Trusted system-in-package solutions, high-density memory and secure SSDs optimized for the edge.
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Trusted system-in-package solutions, high-density memory and secure SSDs optimized for the edge.
With the increasing need for more data to be processed at the sensor for rapid decision-making, modern commercial and defense applications require high-density, high-performance microelectronics solutions in small form factors.
Our compact, ruggedized military-grade microelectronics overcome size, weight and power challenges with low-latency processing and significant space savings for operation in harsh environments at the tactical edge.
TRUSTED MICROELECTRONICS
The power of our game-changing chiplet technology, coupled with our next-generation trusted microelectronics capabilities, provides up to 75% reduction in lead time, thousands of customizable configurations and reliable performance.
Using technologies like high-bandwidth memory, high-bit-rate optical interfaces and gigabit serial...
Bringing trust and supply chain security to the latest commercial semiconductor solutions requires...
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for...
In this webinar, we discuss four decades of innovative 2D and 2.5D microelectronics packaging and...
Contact us to see how we can solve your mission-critical challenges