Mercury Systems Completes Acquisition of Physical Optics Corporation. Learn More.
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With the increasing need for more data to be processed at the sensor for rapid decision-making, modern commercial and defense applications require high-density, high-performance microelectronics in small form factors.
Our compact, ruggedized microelectronics overcome size, weight and power challenges with low-latency processing and significant space savings for operation in harsh environments at the tactical edge.
Accelerate edge computing deployment with system-in-packaging and multi-chip module technologies
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Solve size, weight and power (SWaP) challenges with high-density memory in a low-profile package
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Protect mission-critical data with highly secure, military-grade solid-state drives
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TRUSTED MICROELECTRONICS
The power of our game-changing chiplet technology, coupled with our next-generation trusted microelectronics capabilities, provides up to 75% reduction in lead time, thousands of customizable configurations and reliable performance.
Developing a precision-guided capability small enough to fit into a munition that weighs less than...
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs...
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can...
Presenting leaders from around the world & their perspective on the state of global security....
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