Memory Chip Packages

Shrink Your Memory Footprint up to 87%

Our trusted and secure high density memory is designed for high reliability in harsh environments using advanced three-dimensional (3D) packaging techniques, offering lower power, high-speed performance for the most demanding application requirements. Applying advanced miniaturization technology, we deliver space savings up to 87%.

MEMORY

DDR BGA Memory

DDR BGA Memory

Compact and rugged BGA memory devices for size, weight and power (SWaP) constrained applications

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Embedded NOR Flash

Embedded NOR Flash

Guarantee reliable system operations in harsh environments

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EEPROM Memory

EEPROM Memory

Protect long-term system investments

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INTEGRATED MANUFACTURING

From Chip Scale to System Scale

From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies documented and certified—to minimize your risk.  

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White Paper: Key Technology Considerations for Next-Gen Army Vehicles

Learn about critical technology for next-gen army vehicle autonomous driving, navigation and...

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Learn about Mercury's data recorder solutions for sophisticated technologies to manage and analyze...

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Article: Inside Story - Interview with Vincent Pribble, Prinicipal Product Manager

In this interview, Vincent Pribble, Principal Product Manager at Mercury Systems, discusses current...

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White Paper: Achieving Full Spectrum Dominance with DRFM Technology

DRFM-based radar environment simulators and radar target generators are efficient, cost-effective...

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Contact us to discover what's possible at the edge

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