Military-Grade High-Density Memory

Solve size, weight and power (SWaP) challenges with high-density memory in a low-profile package

Shrink Your Memory Footprint up to 87%

Our trusted and secure high density memory is designed for high reliability in harsh environments using advanced three-dimensional (3D) packaging techniques, offering lower power, high-speed performance for the most demanding application requirements. Applying advanced miniaturization technology, we deliver space savings up to 87%.

RT DDR4 - 8GB

FEATURED PRODUCT

RT DDR4 - 8GB

High-density, secure memory for on-orbit processing

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MEMORY

DDR BGA Memory

DDR BGA Memory

Compact and rugged BGA memory devices for size, weight and power (SWaP) constrained applications

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Embedded NOR Flash

Embedded NOR Flash

Guarantee reliable system operations in harsh environments

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EEPROM Memory

EEPROM Memory

Protect long-term system investments

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INTEGRATED MANUFACTURING

From Chip Scale to System Scale

From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies documented and certified—to minimize your risk.  

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White Paper: Achieving Full Spectrum Dominance with DRFM Technology

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Webinar: Solving EW & SIGINT Signal Acquisition & Latency Challenges

Learn how RF signal analysis, Direct RF technology, signal processing solutions and other components...

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White Paper: The New SiP Device Drives a Leap in RF Edge Processing

Learn about radar and EW RF system design bottlenecks and how Mercury's new Direct RF...

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Video: Learn about Mercury's industry leading capabilities in 2.5D SiP microelectronics

Bringing trust and supply chain security to the latest commercial semiconductor solutions requires...

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Contact us to discover what's possible at the edge

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