Military-Grade High-Density Memory
Solve size, weight and power (SWaP) challenges with high-density memory in a low-profile package
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Solve size, weight and power (SWaP) challenges with high-density memory in a low-profile package
Our trusted and secure high density memory is designed for high reliability in harsh environments using advanced three-dimensional (3D) packaging techniques, offering lower power, high-speed performance for the most demanding application requirements. Applying advanced miniaturization technology, we deliver space savings up to 87%.
INTEGRATED MANUFACTURING
From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies documented and certified—to minimize your risk.
This white paper focuses on a dynamic new answer to the RF edge processing challenge, an adaptation...
Using technologies like high-bandwidth memory, high-bit-rate optical interfaces and gigabit serial...
Bringing trust and supply chain security to the latest commercial semiconductor solutions requires...
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for...
Contact us to see how we can solve your mission-critical challenges