Military-Grade High-Density Memory
Solve size, weight and power (SWaP) challenges with high-density memory in a low-profile package
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Solve size, weight and power (SWaP) challenges with high-density memory in a low-profile package
Our trusted and secure high density memory is designed for high reliability in harsh environments using advanced three-dimensional (3D) packaging techniques, offering lower power, high-speed performance for the most demanding application requirements. Applying advanced miniaturization technology, we deliver space savings up to 87%.
INTEGRATED MANUFACTURING
From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies documented and certified—to minimize your risk.
Using technologies like high-bandwidth memory, high-bit-rate optical interfaces and gigabit serial...
Bringing trust and supply chain security to the latest commercial semiconductor solutions requires...
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for...
In this webinar, we discuss four decades of innovative 2D and 2.5D microelectronics packaging and...
Contact us to see how we can solve your mission-critical challenges