We design and manufacture the best commercial space-saving memory technologies for military applications by ruggedizing, shrinking and incorporating trust and security in all aspects of our business. All our design and manufacturing operations are performed within a domestic DMEA certified facility. Our dense memory packages are ideally suited to airborne, UAV, missile and other applications demanding the highest density and ruggedness performance.
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Mercury’s secure, rugged memory is the most dense available, saving components and up to 87% board space
SnPb Ball Grid Array attachment, extended temperature ranges, under-filling and military hardening for ruggedness
Trusted domestic facilities, encapsulating packaging and trusted devices for security
Best commercial technology, signal line terminations and 100% burn-in for out-of-the-box performance and reliability
MIL-PRF-38534 and MIL-PRF-38535 are the standards which establish the performance and verification requirements of multi-die and single-die integrated circuit device type electronics. Few, including Mercury Systems, are certified to manufacture devices to both MIL-PRF-38534 and MIL-PRF-38535 standards.
Mercury packages the best, most trusted industrial grade memory into low profile packages to reduce its Printed Circuit Board footprint by up to 87%. Memory packages are ruggedized and memory performance is assured through inter-wafer signal terminations.
Mercury specializes in the design and fabrication of custom and mixed memory solutions that solve difficult design challenges. Our customizing capabilities and services include: