Skip to main content

Military-Grade High-Density Memory

Shrink your memory footprint up to 87%

 


Solve size, weight and power (SWaP) challenges with high-density memory in a low profile package. Designed for high reliability in harsh military environments using advanced three-dimensional (3D) packaging techniques.

 


Products


Reduce Size, Weight and Power (SWaP) - Increase System Performance

 

 

Simplify your broad design by integrating a single 16GB DDR4 device in place of 18 independent devices in constrained military embedded systems. Advanced packaging technologies provide data rates as high as 2666 Mb/s for the fastest processors and FPGA devices.


Count on These Devices to Perform

 

Reliable and consistent operation in extreme temperatures and unpredictable shock and vibration. Signal integrity is never compromised through advanced 3D packaging design techniques. 

  


Place Your Trust in a Domestic Partner

 

Trusted and assured design, manufacturing and test operations are performed in a domestic DMEA-accredited facility. Incorporating trust and security in all aspects of business, our robust cybersecurity infrastructure, based on the NIST 800-171 security controls, protects all design and manufacturing records.


Eliminate Tough Design Challenges

Custom mixed memory, system-in-package and multi-chip module design and fabrication provide innovative SWaP solutions for mission-critical systems.  Tailored test solutions ensure only the highest quality products are delivered and results in a significant reduction in field failures.



Contact Us 

Have a question or custom design requirement? Contact us to speak with our team of experts.