Webinar: Accelerating Defense Microelectronics through Our Digital Transformation
March 30, 2021
The Department of Defense (DoD) modernization agenda prioritizes innovative solutions to protect national security. At the forefront of this strategy, advanced microelectronics technology is expanding the microelectronics ecosystem, bringing together commercial and defense markets. At the heart of advanced microelectronics is 2.5D system-in-package technology, a chip-scale solution combining complex semiconductor dies into a single component while maintaining trust and security.
In this webinar, we will discuss four decades of innovative 2D and 2.5D microelectronics packaging and integration and how it supports engineering design with digital thread, then review the latest trends in advanced microelectronics, including:
- The DoD’s strategy for microelectronics and the changing manufacturing ecosystem due to recent global supply chain issues
- Overlapping trends in aerospace, defense and commercial markets
- Products utilizing 2.5D SiP technology for various markets, including AI and security.
- How Mercury's digital transformation of its engineering processes seamlessly supports customers' dynamic application landscapes