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Military-Grade Custom Microelectronics

Advanced Design, Manufacturing and Test

For defense prime contractors seeking to simplify and secure their supply chains, Mercury System has three Advanced Microelectronics Centers (AMC), including our Defense Microelectronics Activity (DMEA)-accredited facility for design, assembly and test. Our tightly integrated engineering, manufacturing and test resources enable production velocity and reduce security vulnerabilities and program risk. Mercury delivers a trusted and assured chain of custody from initial design through assembly and test for sensitive military programs requiring custom microelectronics to achive best-in-class size, weight and power (SWaP) performance.


Custom Capabilities

Custom Design & Engineering

• 2.5D and 3D packaging for SWaP optimization
• Innovative thermal management techniques
• Ruggedization to gun hardening
• Advanced simulation and modeling
• Digital, RF and mixed-signal integration
• Advanced 3D packaging in development using TSV interconnects

 

Advanced Manufacturing

• Epoxy and die attach
• Surface mount to 01005
• Wire bond
• Flip chip
• Encapsulation
• PCB SMT
• Conformal coating

 

High-Reliability Test 

• 100% burn-in
• Full functional
• Environmental: thermal, shock and vibration
• HALT/HASS
• Failure analysis
• Custom test solutions

 

Trusted & Secure Domestic Manufacturing

• DMEA-trusted
• MIL-PRF-38534 and MIL-PRF-38535
• Classified test area
• ITAR controls
• Vetted employees
• AS9100 Rev D certification, ISO 9001:2015
• James S. Cogswell Outstanding Security Achievement Award

 


Why Choose Mercury Systems?

For more than 30 years, Mercury Systems has delivered SWaP-optimized multi-chip modules (MCM) and System-in-Package (SiP) devices. Our advanced thermal and electrical modeling capabilities enable modern FPGA and processor adoption for today and tomorrow’s most advanced military applications. Our domain expertise in rugged 3D packaging eliminates SWaP versus performance compromises.

 

  • Combine surface mount, flip chip, die attach and wire bond technologies on the same device
  • SWaP + Ruggedization – ideal for missiles, munitions and hypersonics
  • Material selection for high reliability - Gold bond wire and Lead (Pb) solder with wide ball pitch
  • Certified to MIL-PRF-38534 Class H and Class K and MIL-PRF-38535 Class M
  • Rapid development cycle from concept to prototype to volume production


Contact Us 

Contact our experts for questions or to get started on a trusted microelectronics design.
Email Us Now

 


Downloads

A national defense imperative, succinctly stated by Army Chief of Staff, General Mark Milley’s “How do we put technology into the hands of our soldiers faster.”

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Learn about advanced miniaturization and 3 packaging technologies that enable customizable secure processing solution for SWaP-constrained military embedded systems.

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