JARVIS Mission Computer, BuiltSAFE™

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Lower cost, mitigate risk and scale airborne applications with ease

JARVIS is an integrated modular avionics 2nd generation (IMA-2G) architecture-based mission computer aligned with the FACE™ technical standard that dynamically allocates application resources across four O-level replaceable computing modules to reduce sustainment cost, downtime and risk.

Built with One High-Performance Module 

JARVIS contains four identical, encrypted JARVI modules with Cortex-A53 processors, GPUs and FPGAs that can be configured and reconfigured to support multiple aircraft applications.

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Reduce Downtime

Mercury's JARVIS features built-in software monitoring, diagnostics, verification features and field-replaceable modules to reduce ground time for operators, flight crews and maintenance teams.

JARVIS Modular Design


Sustainable and Scalable Architecture

  • Saves over $300 million in lifecycle and maintenance costs
  • Integrated modular avionics and 2nd generation (IMA-2G)
  • Aligned with the FACE™ technical standard
  • Built-in fault tolerance that can identify, prioritize, program, recover and dynamically distribute application resources 


  • O-level replaceable with 12-minute repair time
  • Identical <4 lb modules with a single part number
  • Reconfigurable to support multiple applications
  • Can function as a standalone, small-form-factor computer
  • 4 ARM quad A53 64-bit processors featuring neon and floating-point coprocessors
  • 64 GB DDR4 memory 
  • Safety-critical AMD E9171 GPU with full Open GL SC 2.0 and Vulkan SC
  • Dynamically reconfigurable FPGA with 1.3 million logic elements
  • NSA Type-1 and FIPS 140-2 encryption
  • Video capture and switch


  • Rugged: MIL-STD 810, 1686 and 202
  • <30 lb and low power
  • Certifiable up to DAL-A to meet CAST-32A and CAST-29 objectives
  • Built-in networking, monitoring, management and diagnostics
  • Self-testing capability that eliminates the need for automatic test equipment (ATE)
  • ARINC 653-compliant RTOS
  • ARINC 661 model-based GUI
  • ARINC 664, AFDX secure communications



The JARVIS configuration consists of up to 4 DAL-A certifiable computing modules.

Each computing module features:


  • Intel Stratix 10 system on chip (SoC) 
  • Quad-core 64-bit ARM Coretx-A53, 1 GHz
  • 850K to 3M logic elements in the FPGA 
  • 48x full duplex transceivers

Memory and Storage

  • 8 GB DDR4 FPGA memory
  • 8 GB DDR4 processor memory
  • 768 MB NORflash

Integrated Ethernet Switching

  • Port configurable as AFDX or Ethernet

Integrated Graphics Processing Unit

  • AMD E9171 GPU
  • SDI and RS170 video capture to GPU memory
  • SDI and NTSC video output and overlay (symbology, PiP, etc.)

Video Capture and Switch

  • 7x SDI and 4x RS-170 video capture to GPU memory
  • Software configurable video I/O: any video input can go to any video output

Maintenance and Diagnostics
Integrated built-in-test (BIT) capability
Internal health monitoring system

BuiltSAFE™  Proven Elements
DO-254 hardware 
DO-178C graphics CoreAVI OpenGLSC 2.0
Design and information assurance

Mechanical and Environmental
ARINC 600 case size: 5 MCU 
7.64" x 7.87 " x 15.10" (194.06 mm x 199.89 mm x 383.54 mm)
Weight: 28.42 lb (12.7 kg)
Airflow intake: 7.64 g/s @ ≤ 55°C

Module size/weight
Weight: 3.43 lb
Dimensions: 8.396" x 63.845" x 1.9" (213.26 x 176.86 x 48.13 mm)

Rugged and Low Power
Supply voltage: 115 VAC@400 HGz
TDP: 220 WDO-160 G

Software Board Support Packages (BSP)
Integrity-178 TUMP BSP with drivers
Meets CAST-32A objectives
Meets CAST-29 objectives
Other operating systems available upon request: Linux, VxWorks, Deos, LynxOS, PikeOS



  • Platform management  
  • Mission management 
  • Weapons management
  • Flight maintenance   
  • Navigation 
  • Sensor/image/display processing  
  • EO/IR surveillance systems 
  • Airborne sensor fusion


  • Rotary-wing and fixed-wing aircraft 
  • Unmanned aerial vehicles (UAV) 
  • Networked/processor-enabled ground vehicles

Cut Sustainment Costs

JARVIS mission computers use common, reconfigurable, fault-tolerant, O-level replaceable modules to save over $300 million in lifecycle and maintenance costs



Accelerate Subsystem Development

Streamline safety-critical system development and the certification process with DO-254 / DO-178 design assurance checklists, guided assessments, and hardware and software artifacts.