Integrated RF & Digital Architecture for Next-Gen Smart Munitions
Compact RF Interconnects
Solderless interconnects are key to the modular design of our Compact RF solutions. SMP-style RF connectors provide the RF connection between layers and nail-and-socket DC pins surround the parameter of the layers providing the DC contacts. The patented coaxial-to-microstrip transition technology enables high-frequency, orthogonal connections in an extremely compact space.
By formalizing the connections between layers, adding or removing layers becomes easy. For example, the RF front end can be removed for a direct-digitization architecture.
A Scalable and Multi-use Sensor Chain Solution
The modular nature of the SpecrumSeries platform enables rapid scaling and can easily be customized to support a variety of applications. For low complexity designs few layers are needed. As the complexity grows, additional layers are added to increase the functionality. To provide maximum flexibility, each layer can be individually customized to meet specific customer requirements.
Using design principles to optimize for reliability, this technology can benefit applications such as ground-based AESA radars, small form-factor aerospace and precision-guided weapons.
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