Mercury’s new microelectronics packaging technology, BuiltSECURE SiP is a rugged, secure system in package targeting high-performance, SWaP-constrained defense computing systems. Combining our deep domain expertise in systems security engineering and three-dimensional microelectronics packaging, this innovation is ideal for platform management systems, mission management systems and command, control and intelligence applications. The fully customizable architecture addresses the most complex, multi-faceted challenges for the defense industry today in a single, highly ruggedized ball grid array (BGA) package.
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Agile customization - an accelerated time to market with rapid prototyping
Advanced thermal management to meet the demands of modern processors and FPGA devices
Embedded Security to detect and mitigate adversarial attacks
Manufactured in a DMEA - accredited facility protected by a vigilant cyber-security program
Mercury’s advanced miniaturization and stacking technology minimizes footprint allowing more functionality in constrained spaces.
Systems security engineering is built-in to BuiltSECURE SiP for turnkey and customizable security solutions to safeguard against current and emerging threats.
Choose the optimal processing solution including microprocessors, field-programmable gate array (FPGA) devices, memory modules, sensor components and security for your unique program. We deliver it all in a single device. Contact our experts to begin your rapid prototype.