Mercury’s BuiltSECURE System-in-Package (SiP) Secure Processor Platform is the defense industry’s first agile, cost-effective secure processor on a chip solution. Mercury leverages our expertise in three-dimensional packaging and systems security engineering to provide an entire secure processing system miniaturized into an ultra-compact, highly ruggedized ball grid array device. BuiltSECURE SiP delivers four distinct innovations not found in traditional SiP technology (1) Agile Customization, (2) Advanced Thermal Management, (3) Embedded Security, and (4) Trusted Manufacturing. Architects can choose from the latest processors, FPGA devices, Mercury secure memory and sensors without compromising performance restricted by thermal management considerations. BuiltSECURE SiP is ideal for rugged military applications constraint by size, weight and power (SWaP) and needing security solutions to detect and mitigate adversarial attacks.
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Agile customization - an accelerated time to market with rapid prototyping
Advanced thermal management to meet the demands of modern processors and FPGA devices
Embedded Security to detect and mitigate adversarial attacks
Manufactured in a DMEA - accredited facility protected by a vigilant cyber-security program
Mercury’s advanced miniaturization and stacking technology minimizes footprint allowing more functionality in constrained spaces.
Systems security engineering is built-in to BuiltSECURE SiP for turnkey and customizable security solutions to safeguard against current and emerging threats.
Choose the optimal processing solution including microprocessors, field-programmable gate array (FPGA) devices, memory modules, sensor components and security for your unique program. We deliver it all in a single device. Contact our experts to begin your rapid prototype.