System in Package (SiP), also known as Multi-Chip Packages (MCPs) are dense processing subsystems packaged as single entities containing similar/dissimilar devices that may include processors, memory, sensors, triggers, MEMS and other active/passive components. SiPs are the most affordable, lowest-risk and quickest way to meet stringent functional density requirements that may require wire-bond/flip-chip technologies to be pre-integrated with BGA/CSP/SMT fabrications.
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Biggest suite of miniaturizing fabrication processes for design versatility
Rugged to gun-hardening for survivability
Affordability of the best commercial technology and business model
Built-in security for defense applications
Trusted DMEA certified design, manufacture and test facilities
System in Package solutions reduce host board mounting area, increase inter-device signal integrity, simplify BOMs and include build-in security mechanisms for defense applications.
Mercury has the most packaging options, including PBGA (Plastic Ball Grid Array), Ceramic Ball Grid Array (CBGA), Quad Flat Package (QFP), Pin Grid Array (PGA), Small Outline J-lead (SOJ), flat and Dual In-Line (DIL) packages.
Our packaging, software and process engineering capabilities leverage the best commercial technology and our portfolio of rugged package shrinking technologies for the highest processing performance and functional density. Our solutions are simulated for optimal RF, thermal and mechanical ruggedness and verified though extensive electrical, functional and environmental testing.