System in Package

System in Package (SiP), also known as Multi-Chip Packages (MCPs) are dense processing subsystems packaged as single entities containing similar/dissimilar devices that may include processors, memory, sensors, triggers, MEMS and other active/passive components. SiPs are the most affordable, lowest-risk and quickest way to meet stringent functional density requirements that may require wire-bond/flip-chip technologies to be pre-integrated with BGA/CSP/SMT fabrications.

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Capability Highlights


The most design engineering experience

Our packaging, software and process engineering capabilities leverage the best commercial technology and our portfolio of rugged package shrinking technologies for the highest processing performance and functional density. Our solutions are simulated for optimal RF, thermal and mechanical ruggedness and verified though extensive electrical, functional and environmental testing.

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