Custom. Rugged. Secure. BuiltSECURE System in Package (SiP)

Mercury’s new microelectronics packaging technology, BuiltSECURE SiP is a rugged, secure system in package targeting high-performance, SWaP-constrained defense computing systems. Combining our deep domain expertise in systems security engineering and three-dimensional microelectronics packaging, this innovation is ideal for platform management systems, mission management systems and command, control and intelligence applications. The fully customizable architecture addresses the most complex, multi-faceted challenges for the defense industry today in a single, highly ruggedized ball grid array (BGA) package.

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Capability Highlights


BuiltSECURE SiP Agile Customization

Choose the optimal processing solution including microprocessors, field-programmable gate array (FPGA) devices, memory modules, sensor components and security for your unique program.  We deliver it all in a single device.  Contact our experts to begin your rapid prototype.