CIOE-1390 COMe Single Board Computer with BuiltSAFE

Intel Atom® E3900 CPU, PCIe 2.0, 12V, DO-254 and DO-178 artifacts

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Safety-Certifiable, Intel Multi-Core Processing for Avionic Platforms

The CIOE-1390 is the industry’s first commercially-available DO-254/178 DAL-C safety-certifiable Intel® Atom® multi-core compute module designed for the most sophisticated defense and commercial avionics platforms.

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Gain a Competitive Edge

Solving the Performance, Availability Challenges Facing Flight Safety-Certified Applications

With the advent of more capable and available mobile platforms, traditional single-core processors are becoming overtaxed. Although comparatively easy to certify, single-core processors increasingly lack the performance required to drive next-generation smart platforms. Additionally, these processing workhorses face diminishing roadmap support from single-core safety-critical chip fabricators.

By working closely with Intel, Mercury delivers powerful multi-core processing solutions with deliverable design assurance level (DAL-C) artifacts for mission-critical, flight safety-certifiable applications. Powered by Intel Atom dual- and quad-core E3900 Apollo Lake processors, the CIOE-1390 COM Express® module makes available a full x86 processing architecture, complete with GPU capability, in a highly compact and power efficient package.

 

Lower Malfunction Risk and Save Resources

Mercury’s proven avionics modules accelerate safety-critical applications like AI machine vision and augmented reality, expedite the certification process, save aircraft resources and speed subsystem time to market.

FeaturesSpecificationsBoard Support Packages (BSP)
Features

Key Features

  • Intel Atom E3900 (Apollo Lake) SoC
  • COM Express Type-10 Mini module
  • DO-254/178 DAL-C PCB & BIOS/Boot code certification kit
  • OpenGL SC2.0 graphics libraries
  • Intel VTx virtualization and embedded GPU
  • Up to 8 GB DDR3L RAM
  • Onboard eMMC and 32 GB MLC flash memory
  • RoHS 6, 2011/65/EU
  • Rugged, DO-160
  • Safety certification services and support

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Specifications

Processor

  • Atom Apollo Lake E3900 family

Digital display interfaces

  • DP 1.2 (++) 4096 x 2160, @ 60Hz (max resolution)
  • HDMI 1.4 3840 x 2160, @ 60Hz (max resolution)
  • DVI-D 3840 x 2160, @ 60Hz (max resolution)

LVDS

  • Single channel LVDS with one pixel per clock and up to 24-bit color. Maximum
  • pixel clock 112 MHz

Audio

  • Intel HD Audio interface as an ordering option

PCIe

  • Four (4) PCIe Gen-2.0 lanes with the PCIe lane configurations options (4 x1), (2 x1 +
  • 1 x2), (2 x2), and (1 x4), for up to four separate external PCI devices

USB

  • Up to four (4) USB 2.0 ports; two (2) USB 3.0 ports as ordering option

SATA

  • Two (2) SATA Gen 3 storage interfaces with transfer rates of up to 6 Gb/s

Ethernet

  • One (1) 10/100/1000 Mbit Ethernet interface

MAC address

  • Capability to set MAC address

Storage

  • Onboard eMMC 5.0 MLC NAND flash with 2GB to 32GB options

Other Interfaces

  • I2C
  • UART
  • Watchdog timer signal
  • GPIO

Power Supply voltage

  • (VCC) 12 V DC nominal +/- 20%
  • RTC 2.8 V to 3.47 V

Temperature

  • Operating temperature -40°C to +55°C per DO-160G §4.5 Cat A1
  • Short time operating -40°C to +70°C per DO-160G §4.5 Cat A1
  • Ground survival -55°C to +85°C per DO-160G §4.5 Cat A1/A2
  • Temperature variation 5°C/min per DO-160G §5 Cat B
Board Support Packages (BSP)

Board Support Packages (BSP)

  • Green Hills INTEGRTIY-178 tuMP
  • Sysgo PikeOS
  • VxWorks 653
  • DDC-I Deos Windows 10 – non certifiable
  • Linux – non certifiable

Field-Proven Boards

Maximize performance and scalability

Integrate, tailor and optimize your unique subsystem to accelerate mission-critical applications using Mercury’s highly configurable SBCs with Intel single- and multicore processors and multiple mezzanine sites.

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Purpose-Built Subsystems

Built For Today, Ready for Tomorrow

By combining our OpenVPX multiprocessing and SBC modules with a complementary portfolio of storage, I/O, networking, GPUs, and software, we create customizable, rugged embedded subsystems that securely operate at the tactical edge.  

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