Innovation That Cools

Next-gen cooling technologies for OSA embedded processing subsystems

To leverage the best commercial compute capabilities, including data center Xeon® devices for military applications requires the most effective packaging and cooling technologies to deliver rugged, reliable, un-throttled processing performance.

Mercury’s open system architecture (OSA) cooling approach has produced efficient, SWaP and MTBF enhancing solutions for applications ranging from development subsystems in labs, to rugged high-altitude surveillance platforms with redundant air/liquid capabilities. Our cooling technologies are compliant with OSAs in OpenVPX and AdvancedTCA® and scale from traditional forced-air cooling, to rugged conduction-cooling, to the most efficient OSA cooling technologies available - Air and Liquid Flow-By.

 
 

Cooling Technologies

  • Air Flow-By

    Open standard Air Flow-By cooling technology (ANSI/VITA 48.7/48.1) encloses both sides of an existing module to create a sealed FRU with level-2 maintenance (L2M) convenience while providing the most efficient cooling solution in a standard 1-inch pitch. Compared to conduction cooling, it reduces module weight by more than 20 percent and reduces the temperature of a server processor by approximately 5 degrees C, resulting in an MTBF five times higher. Compared to air flow-through cooling, Air Flow-By technology cools both sides of the board while maintaining the standard 1-inch pitch, and provides a sealed environment for protection from EMI, ESD, and airborne contaminants. And now Air Flow-By technology has a cost advantage too, with zero-cost licensing of the associated patent. Mercury offers engineering services to help customers with their own implementations of Air Flow-By cooling to ensure program success.

  • Liquid Flow-By

    Liquid Flow-By seamlessly integrates liquid-cooling capability into Mercury’s Air Flow-By technology. Both Air and Liquid Flow-By uniquely deliver double-sided cooling and are compliant to the rugged OpenVPX and AdvancedTCA OSAs for seamless technology insertions. Proven non-drip technology makes each module and supporting chassis a self-sealing entity, this is critical for liquid cooled subsystems, especially when the coolant is fuel.

  • Conduction-cooling

    Mercury’s conduction-cooled technologies (ANSI/VITA 20) include thermal ribs and cold plates that are optional as defined by the OSA standards to deliver up to six-times the cooling power of similar competing solutions.

  • Air-cooling

    Mercury’s air-cooled integrated XMC cooling approach removes more heat from each mezzanine, to their carrier module and ultimately away from the subsystem through the addition of “hooks”. These “hooks” make a thermal bridge between the mezzanine and module to reduce the mezzanine’s temperature by more than 5 degrees Celsius (or fives time the MTBF).