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Trusted and Assured Chain of Custody
for Sensitive Military Programs

 

 

 

Custom Design and Engineering

Our focus on reliability and manufacturability reduces program risk for our customers’ complex and sensitive military programs.

 SWaP Packaging

Mercury Systems’ expertise in advanced miniaturization and ruggedization technologies enable a custom microelectronic solutions in a SWaP-optimized footprint. Our skilled team of engineers develop multichip modules (MCM) and system in package (SiP) based on our customer’s exact requirements. We utilize state-of-the-art electrical and mechanical design and simulation tools to optimize each device in the smallest, most rugged form factor.

  Thermal Management

Our proprietary thermal design techniques channel heat dissipation from 160 to 800 W of power generated by today’s most advanced processors and FPGA devices.  We accomplish this through the use of multi-layer interlocked spreaders, customized thermal zones and the selection of ideal thermal composite materials to avoid overall CTE mismatch. 

 Ruggedization to Gun Hardening

Military systems operating in harsh environments require the use of military-grade, ruggedized microelectronics.  Recognizing that no two missions are identical, we design all of our solutions to meet mission-specific environmental performance requirements.  From -55°C to +125°C , you can count on our SWaP-optimized devices to operate reliably every time. Optional ruggedization capability to gun-hardening levels is available.

  Simulation

Advanced 2.5D and 3D design techniques require accurate simulation and modeling to achieve power and signal integrity while taking into account thermal effects.   Simulation and modeling of our complex designs enables rapid product development cycles and mitigates program risk. Mercury invests in world class tools for all areas of its business and utilizes the ANSYS suite of simulation and modeling tools to provide thorough performance data to drive successful custom designs.


Advanced Manufacturing

With a 30 year pedigree in microelectronics manufacturing, our Phoenix AMC has delivered microelectronics for the most advanced military programs. 

With an exclusive focus on high-reliability microelectronics for military applications, our DMEA-trusted facility contains state-of-the-art equipment to realize the most complex custom solutions. By mixing die attach, flip chip, wire bond and surface mount technology on the same device, we deliver the most performance in the smallest footprint. Our design engineers work hand-in-hand with our factory floor for a seamless transition to prototype and full rate production.  

  • Epoxy and die attach
  • Surface mount to 01005
  • Wire bond
  • Flip chip
  • Encapsulation
  • PCB SMT
  • Conformal coating

High-Reliability Test Solutions

Our turnkey test solutions assure that only the highest quality product is delivered.  We have domain expertise in testing a broad range of devices:  FPGA, DSP, ASIC, SiP, GPS, GPS M-code, and flash-based devices. 

From functional to environmental to accelerated life testing, our team of test engineers create scalable test solutions addressing

  • MIL-PRF-38534 Class H and Class K for hybrid microcircuits
  • MIL-PRF-38535 Class M for integrated circuits
  • MIL-STD-883 for microelectronics devices

We specialize in developing custom test protocols to address application- and mission-specific reliability requirements.



Contact Us 

Contact our experts for questions or to get started on a trusted microelectronics design.
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