Trusted and Assured Chain of Custody
for Sensitive Military Programs
Custom Design and Engineering
Our focus on reliability and manufacturability reduces program risk for our customers’ complex and sensitive military programs.
Mercury Systems’ expertise in advanced miniaturization and ruggedization technologies enable a custom microelectronic solutions in a SWaP-optimized footprint. Our skilled team of engineers develop multichip modules (MCM) and system in package (SiP) based on our customer’s exact requirements. We utilize state-of-the-art electrical and mechanical design and simulation tools to optimize each device in the smallest, most rugged form factor.
Our proprietary thermal design techniques channel heat dissipation from 160 to 800 W of power generated by today’s most advanced processors and FPGA devices. We accomplish this through the use of multi-layer interlocked spreaders, customized thermal zones and the selection of ideal thermal composite materials to avoid overall CTE mismatch.
Ruggedization to Gun Hardening
Military systems operating in harsh environments require the use of military-grade, ruggedized microelectronics. Recognizing that no two missions are identical, we design all of our solutions to meet mission-specific environmental performance requirements. From -55°C to +125°C , you can count on our SWaP-optimized devices to operate reliably every time. Optional ruggedization capability to gun-hardening levels is available.
Advanced 2.5D and 3D design techniques require accurate simulation and modeling to achieve power and signal integrity while taking into account thermal effects. Simulation and modeling of our complex designs enables rapid product development cycles and mitigates program risk. Mercury invests in world class tools for all areas of its business and utilizes the ANSYS suite of simulation and modeling tools to provide thorough performance data to drive successful custom designs.