Systems Integration

Proven systems engineering and integration expertise optimizes your solution for seamless operation

Deliver more capability, faster and reduce cost with seamless systems integration

Forty years of experience working on 300+ programs have honed our proven systems engineering expertise. Our pre-integrated application-ready platforms streamline development, keep pace with evolving technologies, increase sustainability and ensure program success from start to finish.

Mercury’s experienced engineering, project management and technology teams work across multiple disciplines to integrate and transform the latest commercial and advanced technologies into optimized, field-ready solutions. Our experts handle the rigors of system integration, allowing you to prioritize your core application-specific value.

COTS-Driven Subsystems

Mercury’s open architecture systems leverage our broad portfolio of RF and digital boards combined with third-party modules to offer customized processing solutions. We combine 3U or 6U RF and digital boards with application-ready firmware into a ruggedized embedded subsystem.

Custom Microwave Systems

Mercury’s integrated microwave assemblies leverage the latest in high-frequency circuit design, component integration and thermal management. Our experienced engineering team has the know-how to deliver the right solution, whether surface mount, thin film or a combination of both.

High-Performance Server Cluster

Mercury works closely with customers to configure rugged server stacks that feature the latest data center-caliber technologies, maximize efficiency, and build in the redundancy and security you need so you can do more in the field with less risk.

App-Based EW Platforms

Mercury combines open software, open firmware and open hardware to reinvent the way electronic warfare systems are built, maintained and upgraded. The Rappid™ application-ready platform accelerates EW system development, deployment and sustainment.

Integration at Chip Scale

By applying advanced 2.5D system-in-package technology, we densely integrate the latest semiconductor devices into compact packages - a faster, less expensive, highly customizable approach.


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