Custom Device Packaging & Integration
Trusted 2.5D system-in-package and multi-chip module solutions
Trusted System-in-Package and Multi-Chip Module Solutions
For more than 30 years, we have delivered SWaP-optimized multi-chip modules (MCM) and system-in-package (SiP) devices to mission-critical applications. Manufactured in a DMEA-accredited and AS9100 Rev D facility, our trusted microelectronics solutions leverage the latest in 2.5D integration and 3D device stacking to bring innovative technology to the sensor edge.
- Combine surface-mount, flip-clip, die-attach, and wire-bond technologies
- Rapid development cycle from concept and prototype to volume production
- Material selection for high reliability
- Military-grade, SWaP packaging
- Ruggedization to gun hardening
- Advanced thermal management and simulation techniques
- Certified to MIL-PRF-38534 Class H and Class K and MIL-PRF-38535 Class M
INTEGRATED MANUFACTURING
From Chip Scale to System Scale
From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies documented and certified—to minimize your risk.
Trusted Microelectronics
Trusted Supply Chain Starting at Chip Scale
To deliver the latest commercial technology purpose-built for mission-critical aerospace and defense applications, we start at chip scale with our high-density system-in-package technology, designed and manufactured in trusted and secure DMEA-accredited facilities.
INTEGRATED MANUFACTURING
From Chip Scale to System Scale
From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies, documented and certified, to minimize your risk.
RESOURCES
Learn about Mercury's industry leading capabilities in 2.5D SiP microelectronics
Bringing trust and supply chain security to the latest commercial semiconductor solutions requires...
Microelectronics for the Sensor Edge
We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking...
Redefining Sensor Edge Processing with 2.5D System-in-Package Technology
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can...
Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs...