Custom Device Packaging & Integration
Trusted 2.5D system-in-package and multi-chip module solutions
Trusted 2.5D system-in-package and multi-chip module solutions
INTEGRATED MANUFACTURING
From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies documented and certified—to minimize your risk.
To deliver the latest commercial technology purpose-built for mission-critical aerospace and defense applications, we start at chip scale with our high-density system-in-package technology, designed and manufactured in trusted and secure DMEA-accredited facilities.
From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies, documented and certified, to minimize your risk.
When a leading A&D industry company needed to upgrade three mission-critical EW systems, they found...
Mercury Systems' Rodger Hosking talks to Electronic Design's Bill Wong about the latest SOSA...
Learn about ACAP technology and how it's contributing to faster, stronger and more capable systems...
A flexible design approach integrates individual intellectual property (IP) blocks called chiplets. ...