Custom Device Packaging & Integration

Trusted 2.5D system-in-package and multi-chip module solutions

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Trusted System-in-Package and Multi-Chip Module Solutions 

For more than 30 years, we have delivered SWaP-optimized multi-chip modules (MCM) and system-in-package (SiP) devices to mission-critical applications. Manufactured in a DMEA-accredited and AS9100 Rev D facility, our trusted microelectronics solutions leverage the latest in 2.5D integration and 3D device stacking to bring innovative technology to the sensor edge.

  • Combine surface-mount, flip-clip, die-attach, and wire-bond technologies
  • Rapid development cycle from concept and prototype to volume production
  • Material selection for high reliability
  • Military-grade, SWaP packaging
  • Ruggedization to gun hardening
  • Advanced thermal management and simulation techniques
  • Certified to MIL-PRF-38534 Class H and Class K and MIL-PRF-38535 Class M

INTEGRATED MANUFACTURING

From Chip Scale to System Scale

From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies documented and certified—to minimize your risk.  

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Design Capabilities
  • Advanced 2D and 2.5D dense packaging 
  • Digital, RF and mixed signal integration 
  • Advanced simulation and modeling for rapid customization 
  • Innovative thermal management techniques 
  • Ruggedization to gun hardening 
  • Built-in security to safeguard critical IP 
Advanced Techniques
  • Wafer bonding/debonding 
  • Thermal compression bonding 
  • Plasma activation 
  • Wafer mounting 
  • Reflow 
  • Larger form factor pick-and-place die placement 
  • Backgrind 
  • Dicing 
  • Underfill 
  • Bump height/mechanical measurement 
  • 3D die stacking 
  • Automated epoxy die attach
  • Automated wire bond 
  • Flip chip 
  • Encapsulation 
  • Vacuum molding 
  • Surface mount to 01005 
  • Conformal coating
High-Reliability Testing
  • MIL-PRF-38534 Class H and Class K for hybrid microcircuits 
  • MIL-PRF-38535 Class M for integrated circuits 
  • MIL-STD-883 for microelectronics devices 
Trusted Manufacturing
  • DMEA Trusted Foundry Program Accredited 
  • ITAR controls (all personnel) 
  • COMSEC (Communications Security) 
  • KLIF custodian 
  • AS9100 
  • ISO 9001:2015 
  • ISO 10012 
  • SMT J STD 001 and IPC610 (all inspectors to class 3) 
  • FAA Space Program compliance 
  • James S. Cogswell Outstanding Security Achievement Award 

Trusted Microelectronics

Trusted Supply Chain Starting at Chip Scale

To deliver the latest commercial technology purpose-built for mission-critical aerospace and defense applications, we start at chip scale with our high-density system-in-package technology, designed and manufactured in trusted and secure DMEA-accredited facilities. 

INTEGRATED MANUFACTURING

From Chip Scale to System Scale

From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies, documented and certified, to minimize your risk. 

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