Custom Device Packaging & Integration
Trusted 2.5D system-in-package and multi-chip module solutions
Trusted 2.5D system-in-package and multi-chip module solutions
INTEGRATED MANUFACTURING
From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies documented and certified—to minimize your risk.
To deliver the latest commercial technology purpose-built for mission-critical aerospace and defense applications, we start at chip scale with our high-density system-in-package technology, designed and manufactured in trusted and secure DMEA-accredited facilities.
From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies, documented and certified, to minimize your risk.
Developing a precision-guided capability small enough to fit into a munition that weighs less than...
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs...
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can...
Presenting leaders from around the world & their perspective on the state of global security....