Custom Device Packaging & Integration
Trusted 2.5D system-in-package and multi-chip module solutions
Trusted 2.5D system-in-package and multi-chip module solutions
INTEGRATED MANUFACTURING
From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies documented and certified—to minimize your risk.
To deliver the latest commercial technology purpose-built for mission-critical aerospace and defense applications, we start at chip scale with our high-density system-in-package technology, designed and manufactured in trusted and secure DMEA-accredited facilities.
From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies, documented and certified, to minimize your risk.
This white paper focuses on a dynamic new answer to the RF edge processing challenge, an adaptation...
Using technologies like high-bandwidth memory, high-bit-rate optical interfaces and gigabit serial...
Bringing trust and supply chain security to the latest commercial semiconductor solutions requires...
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for...