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EnsembleSeries™ CIOE-1390

Intel Processing BuiltSAFE™

The industry’s first commercially-available DO-254/178 DAL-C safety-certifiable Intel Atom multicore compute module designed for the most advanced defense and commercial avionics platforms. 

Certifiable, multi-core Intel processing capability

With the advent of more capable and available mobile platforms, traditional single-core processors are becoming overtaxed. Although comparatively easy to certify, single-core processors increasingly lack the performance required to drive next-generation smart platforms. Additionally, these processing workhorses face diminishing roadmap support from single-core safety-critical chip fabricators.   

Mercury is solving the performance and availability challenge by working closely with Intel to launch powerful multicore processing solutions with deliverable design assurance level (DAL)-C artifacts for mission-critical, flight safety-certifiable applications. Powered by Intel Atom dual- and quad-core E3900 Apollo Lake processors, the new CIOE-1390 COM Express module delivers a full x86 processing architecture, complete with GPU capability, in a highly compact and power efficient package. 

Design assurance level (DAL) artifacts

EnsembleSeries CIOE-1390 modules are available with full DO-254 DAL-C flight safety certification evidence for the circuit card assembly and DO-178C DAL-C evidence for the highly optimized and custom BIOS and bootloader software. The availability of these artifacts enable system safety certification to be performed faster, at a lower cost and with less risk than by other approaches.

Coupling the EnsembleSeries CIOE-1390 with the BuiltSAFE-GS OpenGL SC2 embedded graphics libraries for Intel Gen 9 graphics cores produces industry-leading processing performance per watt. A proven safety-certifiable solution to high resolution in-cockpit displays is especially suited to mission-critical flight, synthetic and enhanced vision and digital moving map applications.

Gain a Competitive Edge



  • Intel Atom® E3900 (Apollo Lake) SoC
  • DO-254/178 DAL-C PCB & BIOS/Boot code certification kit
  • OpenGL SC2.0 graphics libraries for multiple RTOS (including DO-178C certification kit)
  • Intel VTx virtualization and embedded GPU
  • Up to 8GB ECC DDR3L RAM (soldered)
  • Onboard eMMC and up to 32GB MLC flash memory



  • COM Express Type 10 Mini
  • 84 mm x 55 mm (3.3" x 2.17") – 5 mm connector pitch
  • DO-254 - Design Assurance Guidance for Airborne Electronic Hardware
  • DO-178C - Software Considerations in Airborne Systems and Equipment Certification
  • RoHS 6, 2011/65/EU
  • Operating temperature: -40°C to +55°C per DO-160G 4.5 Cat A1