FIOVU-2180 6U OpenVPX FPGA Board with Optical I/O and BuiltSAFE

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Accelerate airborne workloads and safely hotswap application IP

The first safety-certifiable FPGA board with Intel® Xeon® D-1700 processors

Built with dual Xilinx Virtex® UltraScale+™ XCVU9P FPGAs, Gen10 Intel Xeon D processors and delivered with DO-254 artifacts certifiable up to DAL-C, Mercury’s rugged FIOVU-2180 board streamlines avionics and mission computer system development and deployment. 

The FPGAs can run real-time data analysis algorithms and use the processor to change algorithm parameters and increase signal algorithm performance by 10x. The processor can also accelerate airborne workloads such as infrared/LIDAR and run neural network or CNN inference for AI vision algorithms used in vision semantics, target recognition, surveillance and electronic warfare applications.

Swap real-time algorithms and speed IP development

The FIOVU-2180’s dynamically reconfigurable FPGA framework IP simplifies and speeds FPGA programming, allowing users to dynamically reload FPGA content or hot swap algorithms without rebooting or shutting down running FPGA workloads. 

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Increase Decision Accuracy

Mercury’s 6U BuiltSAFE boards enable advanced sensors and AI for military and commercial aircraft providing ground stations with real-time information, and giving pilots what they need to make accurate and timely decisions.


Key Features

  • Dual Xilinx Virtex® UltraScale+™ XCVU9P FPGAs to support real-time algorithms
  • Intel® Xeon® D-1700 4 core processor that delivers that deliver 2-3x more performance than previous generation boards and improve signaling
  • Ultra-wide copper & fiber optic Interlaken interfaces
  • Dynamically reconfigurable firmware framework to simplify and speed FPGA programming
  • Safety certifiable with complete DO-254 and DO-178C artifacts 
  • PCIe 3.0 system interconnect to accelerate high bandwidth applications 
  • Rugged, DO-160, MIL-STD-810G 
  • 100-120 W power-efficient performance
  • Board support packages for Wind River VxWorks to achieve FAA CAST-32A objectives
  • Build a high performance mission computer with 2 FIOVU-2180 boards and 2 CIO10-2080 single board computers.
  • Safety certification services and support

In Collaboration with: 




  • (2) Xilinx Virtex® UltraScale+™ XCVU9P
  • Dynamically reconfigurable firmware framework

FPGA Memory

  • DDR4-2666 64GB (64 bit) ECC with 32 GB per FPGA (2 channels)
  • 4 Gb dual QSPI Flash with 2 Gb per FPGA


  • (2) PCIe 3.0 x8 (one per FPGA)
  • (2) UART (one per FPGA)*
  • (2) SGMII (one per FPGA) *
  • (3) x12 high-speed copper @ 10.3125Gbps*
  • (1) x12 high-speed optical @ 10.3125Gbps*

* copper and fiber optic interfaces for 10GBASE-R/40GBASE-R4, Interlaken, Aurora, etc. Multiple protocols supported, implementation is user-dependent


  • Intel® Xeon® D-1700 @ 1.9GHz, 4-core

Processor Memory

  • DDR4-2666 16GB (64 bit) ECC

Processor I/O

  • (1) UART (3.3V, HSUART)
  • (2) SGMII
  • (1) PCIe x8 Gen3
  • (2) USB 2.0
  • (1) USB 3.0 (DCI capable)
  • Optical Interface
  • VITA 66.4 Fiber-Optic connector with integrated x12 transceivers on VPX-P6

Debug/Development Features

  • JTAG via backplane (P0) usable for FPGA development/debug & load of SPI Flash
  • PCIe bus usable during development
  • Intel® direct connect interface (DCI) allows Intel® targets debugging via USB 3.0 port
  • UART via backplane usable for both processor and FPGA debugging (firmware dependent)

BuiltSAFE® Proven Elements

  • DO-254 hardware
  • DO-178C board management features and processor board support packages
  • Design and information assurance up to DAL-D

BuiltSAFE® Board Management Features

  • Board management controller (BMC)
  • Built-in-test (BIOS and software)
  • Temperature monitoring
  • Watchdog (using internal processor mechanism)
  • Error reporting (temp/voltage alarm)
  • Reset management
  • Power sequencing
  • Debug and maintenance mode
  • Security trusted platform module (TPM 2.0, secure boot)
  • Elapsed time counter


  • Rear transition module capability

Rugged and Low Power

  • Operating temp: -26°C to 55°C
  • DO-160G
  • MIL-STD-810G CHG1
  • MIL-STD-1686C
  • MIL-STD-202H
  • 100 W – 120 W power consumption 


  • 6U OpenVPX, 1.2" slot pitch, ANSI/VITA 65-2019
  • MULTIGIG RT3 (up to 25Gbps)
  • MOD6-PAY-4F1Q2U2T1A-12.6.2-n and SLT6-PAY-4F1Q2U2T1A-10.6.2-n slot profile
  • VITA 46 / VPX REDI VITA 48.8 / VITA 65-2019, VITA 66.4 (backplane fiber-optic), VITA 46.11
  • SGMII, PCIe 3.0, USB 2.0/3.0
  • VITA 48.8 air-flow-through cooling
Board Support Packages (BSP)

Board Support Packages (BSP)

  • UEFI firmware based on Intel Slim Bootloader for faster boot
  • BuiltSAFE® board monitoring package
  • WindRiver VxWorks 7.0
  • Linux*
  • Greenhills*
  • Deos*
  • LynxOS*
  • PikeOS*

*Contact factory for availability

Purpose-Built Subsystems

Built For Today, Ready for Tomorrow

By combining our OpenVPX multiprocessing and SBC modules with a complementary portfolio of storage, I/O, networking, GPUs, and software, we create customizable, rugged embedded subsystems that securely operate at the tactical edge.  

Learn More


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