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Themis RES-HD

Available in a 2U (four bay) or 3U (six bay) chassis, Themis RES-HD servers integrate the latest Intel® Xeon® Scalable processors and provide maximum versatility with over six configurable “plug and pull” compute, storage, networking, expansion, or management modules.  Modules can be mixed and matched – with each combination creating a new type of functionality.

Eliminate Rip and Replace

Each chassis has a typical 15-year lifespan—eliminating the need to rip and replace during technology upgrades and streamlining deployment. With lightweight modules, RES HD simplifies logistics, cuts costs associated with spares, and enables modules to be repurposed across different applications.

Modular Composability

Each Themis RES-HD chassis accomodates current, previous, and future generation RES HD modules. The newest generation RES XR6 HD modules integrate the latest Intel Xeon Scalable processors to deliver superior workload-optimized performance and hardware-enhanced security in a smaller footprint.


   Featuring the latest Intel Xeon Scalable Processors

   Featuring Intel Xeon E5-2600 v3/v4 series processors


  • Height: 5.25" (133.35mm) for 3U, 3.5" (88.9mm) for 2U
  • Width: 17" (432mm)
  • Depth: 20.0" (508mm)
  • Chassis Weight: 16 lbs (7.26 kg) for 2U, 24.5 lbs (11.1 kg) for 3U

weights above include power supplies

Additional Options

  • Shock Pins
  • Front Door Filter
  • Slide Rails

Power Supply Options

  • Single or Redundant 100/240V VAC (1200W, 50/60Hz, 400Hz)
  • Single or Redundant 10-36 VDC, 32 Amps
  • Single or Redundant 36-72 VDC, 18 Amps


  • Temperature: 0°C to 50°C
  • Extended Temperature: -15°C to 65°C
  • Humidity: 8% to 95%
  • Shock: 3 axis, 35g, 25ms
  • Vibration (10-2000Hz): 4.76Grms, 5Hz to 2000 HZ (SSD)

Non-Operating (if different)

  • Temperature: -40°C to 70°C
  • Humidity: 5% to 95%


  • Safety: EN60950
  • RFI/EMI: EN 55032, EN 55024, EN 61000
  • MIL-STD 810G