DDR Products

Compact and rugged BGA memory devices for size, weight and power (SWaP) constrained applications

  • slide

Military-Grade High-Density Memory

Since 2000, our miniaturization technology has transformed DDR memory into ultra-compact and rugged BGA devices ideal for size, weight and power (SWaP) constrained military applications. With BuiltSECURE™ trust and assurance, all of Mercury’s secure memory devices are engineered to operate reliably in high performance military embedded systems.

All products are available in commercial (C), industrial (I), and military (M) temperature grades.

INFOGRAPHIC

HIGH-DENSITY DDR FOR THE TACTICAL EDGE

Mercury's high-density DDR memory
maximizes processing performance
in the most challenging environments.

DISCOVER MORE

Explore DDR Memory Products

DDR4 Memory 

Type Size Organization Part Number Data Rate Voltage (V) Package Dimensions
DDR4 8GB 1Gx72 4N1G72T-XB2X 1333-2400 1.2 321 PBGA 13mm x 20mm
DDR4 4GB 512Mx72 4N512M72T-XB2X 1333-2400 1.2 321 PBGA 13mm x 20mm

DDR3 Memory

Type Size Organization Part Number Data Rate Voltage (V) Package Dimensions
DDR3 8GB 1GBx72 W3J1G72KT-XLBX 800-1600 1.35 543 PBGA 23mm x 32mm
DDR3 4GB 512Mx64 W3J512M64X-XLB2X 800-1600 1.35 543 PBGA 23mm x 32mm
DDR3 4GB 512Mx72 W3J512M72K-XLB2X 800-1600 1.35 543 PBGA 23mm x 32mm
DDR3 4GB HD 512Mx72 W3J512M72K(T)-XHDX 800-1600 1.35 399 PBGA 14mm x 21.5mm
DDR3 2GB 512Mx32 W3J512M32X-XB3X 800-1600 1.35 136 PBGA 10mm x 14.5mm
DDR3 2GB 512Mx32 W3J512M32X(T)-XB3X 800-1333 1.35 204 PBGA 10mm x 14.5mm
DDR3 1GB 128Mx72 W3J128M72X-XLBX 800-1600 1.35 375 PBGA 21.5mm x 20.5mm
DDR3 1GB 128Mx64 W3J128M64X-XLBX 800-1600 1.35 375 PBGA 21.5mm x 20.5mm

DDR2 Memory 

Type Size Organization Part Number Data Rate Voltage (V) Package Dimensions
DDR2 512MB 64Mx64 W3H64M64E-XBX 400-667 1.8 208 PBGA 16mm x 22mm
DDR2 512MB 64Mx72 W3H64M72E-XBX 400-667 1.8 208 PBGA 16mm x 22mm
DDR2 256MB 32Mx72 W3H32M72E-XBX 400-667 1.8 208 PBGA 16mm x 20mm
DDR2 256MB 32Mx64 W3H32M64E-XBX 400-667 1.8 208 PBGA 16mm x 20mm
DDR2 256MB 2x64Mx16 W3H264M16E-XBX 400-667 1.8 79 PBGA 11mm x 14mm
DDR2 256MB 2x64Mx16 W3H264M16E-XB2X 400-667 1.8 79 PBGA 11mm x 14mm
DDR2 128MB 64Mx16 W3H64M16E-XB2X 400-667 1.8 79 PBGA 11mm x 14mm
DDR2 1GB 128Mx72 W3H128M72E-XNBX 400-667 1.8 208 PBGA 16mmx22mm
DDR2 1GB 128Mx72 W3H128M72E-XSBX 400-667 1.8 208 PBGA 16mm x 22mm
DDR2 1GB 128Mx72 W3H128M72ER-XNBX 400-667 1.8 255 PBGA 21mm x 23mm

DDR Memory

Type Size Organization Part Number Data Rate Voltage (V) Package Dimensions
DDR 512MB 64Mx72 W3E64M72S-XBX 200-266 2.5 219 PBGA 32mm x 25mm
DDR 256MB 32Mx64 W3E32M64S-XB3X 200-333 2.5 208 PBGA 13mm x 22mm
DDR 256MB 32Mx72 W3E32M72S-XB3X 200-333 2.5 208 PBGA 13mm x 22mm
DDR 256MB 32Mx72 W3E32M72S-XBX 200-333 2.5 219 PBGA 32mm x 26mm
DDR 256MB 32Mx72 W3E32M72SR-XBX 200-266 2.5 208 PBGA 13mm x 22mm
DDR 256MB 32Mx64 W3E32M64S-XB2X 200-333 2.5 219 PBGA 21mm x 21mm
DDR 256MB 32Mx64 W3E32M64SA-XB2X 200-333 2.5 219 PBGA 21mm x 21mm
DDR 128MB 64Mx16 W3E64M16S-XBX 200-333 2.5 60 PBGA 10mm x 12.5mm

DOWNLOADS

Secure Solid State Drives, Extended Temperature Memories, Ceramic Memories, Applications Engineering Performance, Layout & Design Benefits, SiP Capabilities

Download Now

This technical brief examines Mercury's portfolio of High Density Secure Memory products, a unique offering of high-speed, military-hardened memory solutions in small form factors.

Download Now

High density secure memory DDR4 SDRAM product family datasheet

Download Now

High density secure memory DDR3 SDRAM product family datasheet

Download Now

High density secure memory DDR2 SDRAM product family datasheet

Download Now

High density secure memory DDR SDRAM product family datasheet

Download Now

DISCOVER MORE

Military-Grade High-Density DDR Memory Product Brief

Compact and rugged DDR memory components for SWaP-constrained applications

SEE MORE

High-Density DDR for the Tactical Edge Infographic

Processing large volumes of data in rugged environments away from climate-controlled data centers...

SEE MORE

On Demand: Overcoming Memory Design Challenges in High-Performance Edge Computing

In this webinar, discover how to address memory design challenges at the sensor edge with modern...

SEE MORE

White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can...

SEE MORE