DDR Products
Compact and rugged BGA memory devices for size, weight and power (SWaP) constrained applications
Military-Grade High-Density Memory
Since 2000, our miniaturization technology has transformed DDR memory into ultra-compact and rugged BGA devices ideal for size, weight and power (SWaP) constrained military applications. With BuiltSECURE™ trust and assurance, all of Mercury’s secure memory devices are engineered to operate reliably in high performance military embedded systems.
All products are available in commercial (C), industrial (I), and military (M) temperature grades.
Explore DDR Products
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| Type | Size | Organization | Part Number | Data Rate | Voltage (V) | Package | Dimensions | Datasheet |
|---|---|---|---|---|---|---|---|---|
| DDR4 | 8GB | 1Gx72 | 4N1G72T-XBX | 1333-2400 | 1.2 | 321 PBGA | 13mm x 20mm | |
| DDR4 | 8GB | 1Gx72 | 4N1G72T-XB2X | 1333-2400 | 1.2 | 321 PBGA | 13mm x 20mm | |
| DDR4 | 4GB | 512Mx72 | 4N512M72T-XB2X | 1333-2400 | 1.2 | 321 PBGA | 13mm x 20mm | |
| DDR4 | 4GB | 512Mx72 | 4N512M72T-XBX | 1333-2400 | 1.2 | 321 PBGA | 13mm x 20mm | |
| DDR3 | 8GB | 1GBx72 | W3J1G72KT-XLBX | 800-1600 | 1.35 | 543 PBGA | 23mm x 32mm | |
| DDR3 | 4GB | 512Mx64 | W3J512M64X-XLB2X | 800-1600 | 1.35 | 543 PBGA | 23mm x 32mm | |
| DDR3 | 4GB | 512Mx72 | W3J512M72K-XLB2X | 800-1600 | 1.35 | 543 PBGA | 23mm x 32mm | |
| DDR3 | 4GB HD | 512Mx72 | W3J512M72K(T)-XHDX | 800-1600 | 1.35 | 399 PBGA | 14mm x 21.5mm | |
| DDR3 | 2GB | 512Mx32 | W3J512M32X-XB3X | 800-1600 | 1.35 | 136 PBGA | 10mm x 14.5mm | |
| DDR3 | 2GB | 512Mx32 | W3J512M32X(T)-XB3X | 800-1333 | 1.35 | 204 PBGA | 10mm x 14.5mm | |
| DDR3 | 1GB | 128Mx72 | W3J128M72X-XLBX | 800-1600 | 1.35 | 375 PBGA | 21.5mm x 20.5mm | |
| DDR3 | 1GB | 128Mx64 | W3J128M64X-XLBX | 800-1600 | 1.35 | 375 PBGA | 21.5mm x 20.5mm | |
| DDR2 | 512MB | 64Mx64 | W3H64M64E-XBX | 400-667 | 1.8 | 208 PBGA | 16mm x 22mm | |
| DDR2 | 512MB | 64Mx72 | W3H64M72E-XBX | 400-667 | 1.8 | 208 PBGA | 16mm x 22mm | |
| DDR2 | 256MB | 32Mx72 | W3H32M72E-XBX | 400-667 | 1.8 | 208 PBGA | 16mm x 20mm | |
| DDR2 | 256MB | 32Mx64 | W3H32M64E-XBX | 400-667 | 1.8 | 208 PBGA | 16mm x 20mm | |
| DDR2 | 256MB | 2x64Mx16 | W3H264M16E-XBX | 400-667 | 1.8 | 79 PBGA | 11mm x 14mm | |
| DDR2 | 256MB | 2x64Mx16 | W3H264M16E-XB2X | 400-667 | 1.8 | 79 PBGA | 11mm x 14mm | |
| DDR2 | 128MB | 64Mx16 | W3H64M16E-XB2X | 400-667 | 1.8 | 79 PBGA | 11mm x 14mm | |
| DDR2 | 1GB | 128Mx72 | W3H128M72E-XNBX | 400-667 | 1.8 | 208 PBGA | 16mmx22mm | |
| DDR2 | 1GB | 128Mx72 | W3H128M72E-XSBX | 400-667 | 1.8 | 208 PBGA | 16mm x 22mm | |
| DDR2 | 1GB | 128Mx72 | W3H128M72ER-XNBX | 400-667 | 1.8 | 255 PBGA | 21mm x 23mm | |
| DDR | 512MB | 64Mx72 | W3E64M72S-XBX | 200-266 | 2.5 | 219 PBGA | 32mm x 25mm | |
| DDR | 256MB | 32Mx64 | W3E32M64S-XB3X | 200-333 | 2.5 | 208 PBGA | 13mm x 22mm | |
| DDR | 256MB | 32Mx72 | W3E32M72S-XB3X | 200-333 | 2.5 | 208 PBGA | 13mm x 22mm | |
| DDR | 256MB | 32Mx72 | W3E32M72S-XBX | 200-333 | 2.5 | 219 PBGA | 32mm x 26mm | |
| DDR | 256MB | 32Mx72 | W3E32M72SR-XBX | 200-266 | 2.5 | 208 PBGA | 13mm x 22mm | |
| DDR | 256MB | 32Mx64 | W3E32M64S-XB2X | 200-333 | 2.5 | 219 PBGA | 21mm x 21mm | |
| DDR | 256MB | 32Mx64 | W3E32M64SA-XB2X | 200-333 | 2.5 | 219 PBGA | 21mm x 21mm | |
| DDR | 128MB | 64Mx16 | W3E64M16S-XBX | 200-333 | 2.5 | 60 PBGA | 10mm x 12.5mm |
Downloads
Secure Solid State Drives, Extended Temperature Memories, Ceramic Memories, Applications Engineering Performance, Layout & Design Benefits, SiP Capabilities
This technical brief examines Mercury's portfolio of High Density Secure Memory products, a unique offering of high-speed, military-hardened memory solutions in small form factors.