What is chip-scale system development?
By applying advanced 2.5D system-in-package technology, the latest semiconductor devices can be densely integrated into compact packaging. This building-block approach to processing solution development is faster and less expensive than traditional methods and opens a range of options for customization. Mercury is a pioneer of chip-scale system development, making advanced commercial technology profoundly more accessible to aerospace and defense.
Enabling high-performance systems for artificial intelligence (AI) at the edge
SWaP optimization at chip-scale delivers AI processing to the sensor.
We bring the latest commercial digital and RF processing together with advanced military-grade security to deliver customizable system-in-package solutions designed to perform reliably in challenging environments over the entire lifetime of edge systems. From high-frequency digitization to AI processing, you can put the entire sensor chain into a single device small enough to fit into the palm of your hand.
Massive Chip-Scale Performance in the Smallest Form Factors Possible
At Mercury, we make cutting-edge commercial technologies profoundly more accessible to all customers and seamlessly customize them for today’s most advanced A&D applications. Leveraging high-density 2.5D system-in-package technology, custom-designed silicon interposers and 3D die-stacking integration, we partner with leading semiconductor manufacturers to deliver advanced technology to the harshest environments.
A New Paradigm for Defense-Grade Microelectronics Emerges
As the global geopolitical environment becomes more complex, new threats have evolved while military budgets endure increasing pressure. Worldwide, defense forces are shifting priorities, placing advanced technology at the forefront of modernization and acquisition agendas. Tapping into the innovation of the commercial sector has become a top priority. Tom Smelker, General Manager of our Microsystems business unit, explains how this new priority impacts the industry.
Delivering RF and Digital Integration
The most effective radar and EW response techniques demand extremely low latency as signals transition back and forth between analog RF and digital. It has become essential to tightly integrate multiple RF and digital functions in sensor edge processing systems to effectively manage and manipulate data flows. Our system-in-package capability integrates die, assembly and packaging of RF and digital components, while optimizing real-time performance, miniaturization, cost and development time.
Enabled by Custom Silicon Interposers
For the ultimate in SWaP optimization, highly complex semiconductor devices are integrated into system-in-package architectures using custom-designed interposers with through-silicon. This technology reduces the need for large signal-routing boards and maximizes signal integrity, significantly reducing the size of the sensor processing solution.
Produced with a Trusted Manufacturing and Supply Chain
As an established supplier of the DMEA Trusted Integrated Circuits (IC) Program, we provide trusted design, manufacturing and testing in our manufacturing facilities. We also provide a wide range of leading-edge semiconductor packaging and integration technologies and services while maintaining an assured U.S. supply chain.
THE MERCURY ADVANTAGE
High-throughput, low-latency performance with PCIe Gen 4 technology including Intel® 3rd gen Xeon® Scalable processors, fast storage and GPUs.
RES XR7 servers come with the most comprehensive lifetime warranty in the market.
Only built in DMEA facilities with a managed U.S. supply chain
Increase tech-insertion speed and lower program risk with proven, modular, open-standards designs.
ELECTRONIC WARFARE SOLUTIONS
Delivering Technology Innovation to the Spectrum
From chip scale to system scale, we make the most advanced technologies profoundly more accessible to electronic warfare test, training and tactical applications