Chip-Scale System Development

What is chip-scale system development?

By applying advanced 2.5D system-in-package technology, the latest semiconductor devices can be densely integrated into compact packaging. This building-block approach to processing solution development is faster and less expensive than traditional methods and opens a range of options for customization. Mercury is a pioneer of chip-scale system development, making advanced commercial technology profoundly more accessible to aerospace and defense. 

CHALLENGE

Enabling high-performance systems for artificial intelligence (AI) at the edge

SOLUTION

SWaP optimization at chip-scale delivers AI processing to the sensor.

We bring the latest commercial digital and RF processing together with advanced military-grade security to deliver customizable system-in-package solutions designed to perform reliably in challenging environments over the entire lifetime of edge systems. From high-frequency digitization to AI processing, you can put the entire sensor chain into a single device small enough to fit into the palm of your hand.

Massive Chip-Scale Performance in the Smallest Form Factors Possible

At Mercury, we make cutting-edge commercial technologies profoundly more accessible to all customers and seamlessly customize them for today’s most advanced A&D applications. Leveraging high-density 2.5D system-in-package technology, custom-designed silicon interposers and 3D die-stacking integration, we partner with leading semiconductor manufacturers to deliver advanced technology to the harshest environments.

A New Paradigm for Defense-Grade Microelectronics Emerges

As the global geopolitical environment becomes more complex, new threats have evolved while military budgets endure increasing pressure. Worldwide, defense forces are shifting priorities, placing advanced technology at the forefront of modernization and acquisition agendas. Tapping into the innovation of the commercial sector has become a top priority. Tom Smelker, General Manager of our Microsystems business unit, explains how this new priority impacts the industry.

READ BLOG POST

Delivering RF and Digital Integration

The most effective radar and EW response techniques demand extremely low latency as signals transition back and forth between analog RF and digital. It has become essential to tightly integrate multiple RF and digital functions in sensor edge processing systems to effectively manage and manipulate data flows. Our system-in-package capability integrates die, assembly and packaging of RF and digital components, while optimizing real-time performance, miniaturization, cost and development time.

LEARN MORE

Enabled by Custom Silicon Interposers

For the ultimate in SWaP optimization, highly complex semiconductor devices are integrated into system-in-package architectures using custom-designed interposers with through-silicon. This technology reduces the need for large signal-routing boards and maximizes signal integrity, significantly reducing the size of the sensor processing solution.

LEARN MORE

Produced with a Trusted Manufacturing and Supply Chain

As an established supplier of the DMEA Trusted Integrated Circuits (IC) Program, we provide trusted design, manufacturing and testing in our manufacturing facilities. We also provide a wide range of leading-edge semiconductor packaging and integration technologies and services while maintaining an assured U.S. supply chain.

DISCOVER MORE

FEATURED PRODUCTS

RFS1080 RF System-in-Package

RFS1080 RF System-in-Package

SEE MORE

Custom Device Packaging & Integration

Custom Device Packaging & Integration

SEE MORE

FPGA, Analog IO Boards

FPGA, Analog IO Boards

SEE MORE

Open Spectrum Processing

Open Spectrum Processing

SEE MORE

ELECTRONIC WARFARE SOLUTIONS

Delivering Technology Innovation to the Spectrum

From chip scale to system scale, we make the most advanced technologies profoundly more accessible to electronic warfare test, training and tactical applications

DISCOVER MORE

DISCOVER MORE

Video: Learn about Mercury's industry leading capabilities in 2.5D SiP microelectronics

Bringing trust and supply chain security to the latest commercial semiconductor solutions requires...

SEE MORE

A New Paradigm for Defense-Grade Advanced Microelectronics

As the DoD shifts to a new paradigm for future modernization, see how Mercury Systems is...

SEE MORE

Tech Brief: Microelectronics for the Sensor Edge

We leverage HD 2.5D system-in-package technology, custom silicon interposers, 2D die stacking...

SEE MORE

White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can...

SEE MORE