RES AI XR6 3U, 16 Drive 20 Inch Rugged GPU Server

Dual Intel® Xeon® Scalable processors, 5 double-wide NVIDIA GPUs, 4TB memory and 16 disk drives

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Compact 20 Inch Deep, Rear I/O Supercomputing Server

Engineered to handle massive workloads anywhere, Mercury’s RES AI 3U supercomputing server packs dual Intel® Xeon® Scalable processors, five double-wide NVIDIA Tesla GPUs, 4TB DDR4 ECC memory and 240TB of storage in a compact 38lb server form factor. 



  • Up to five NVIDIA® Tesla® GPGPUs or Quadro® GPUs
  • Dual Intel® Xeon® Scalable CPU with up to 28 cores per processor 
  • Up to 4TB DDR4 ECC memory
  • Up to 240TB of storage with sixteen  2.5" front-access disk drives (SAS3, SATA or NVME)
  • 11 PCIe 3.0 cards
  • MIL-STD: 810G, 901D, 167-1, 1474D, 740-2, 461F
  • Customizable with U.S. designed and manufactured motherboards and advanced security features
  • Manufactured in AS5553 compliant, AS9100D facilities

Patented Technology Options
In addition to memory stabilization, this server features numerous patented technology options including:

  • System control module for remote management
  • Aeroloc Baffle system for low airflow operations
  • Remote battery bypass that enables BIOS battery replacement without system shutdown
  • Dual Intel® Xeon® Scalable CPUs with up to 28 cores per processor
  • Bronze, Silver, Gold, or Platinum
  • Up to 5 double-wide NVIDIA Tesla or Quadro GPU accelerators
  • Up to 4TB 2933MHz memory

Patented Technologies

  • Memory stabilization
  • Aeroloc baffle system
  • System control module for acoustic and remote management

Management and Operating System

  • Windows®, Linux®, VMware® and other hypervisors
  • IPMI v2.0, Redfish option available
  • TPM 1.2 or 2.0 support

Expansion and Modular Maintainability

  • PCIe 3.0 Card Options:
    • 6 PCIe 3.0 x16 cards 
    • 11 PCIe 3.0 x8 cards
  • 1 Internal M.2 PCIe drive

Power Supply Options

  • Single 100/240V VAC (47/63Hz, 400Hz)
  • Single 10-36 VDC, 32 Amps
  • Single 36-72 VDC, 18 Amps
  • MIL-STD 461, 704F, 1399-300B

Input/Output Versatility

Front Access

  • Up to 16 removable, hot pluggable, 2.5” SATA/SAS3 drives, U.2 NVME option available
  • can configure with up to (8) 15mm or (16) 7mm (SATA) high drives
  • 1 Power/Reset Switch
  • 1 Power on LED
  • 1 Quick change CMOS battery
  • 1 Blu-Ray or DVD/CD ROM drive (optional)
  • 2 USB 3.0
  • 1 RS-232

Rear Access

  • 2 1GBaseT or 10GBaseT Ethernet Ports (RJ45)
  • 1 IPMI 2.0 (RJ45)
  • 1 CFM Switch (optional)
  • 2 USB 3.0 (optional)
  • 1 RS-232 (optional)

Additional Options

  • Front door filter
  • Slide rails
  • CAC card reader
  • Read/Write switches to prevent accidental rewrite


Environmental & Mechanical

MIL-STD / Industrial Specifications

  • MIL-STD 810G
  • Shock: MIL-STD 901D Grade A, IEC 60068-2-27
  • EMI/RFI: MIL-STD 461F, CE102 standard
  • Vibration: MIL-STD 167-1, MIL-STD 810G, IEC 60068-2-64
  • Airborne noise: MIL-STD 1474D
  • Structure borne noise: MIL-STD 740-2
  • Temperature: IEC 60068-2-2 test Bb, 60068-2-1 test Ab



  • Temperature: 0°C to 50°C
  • Extended Temperature: -15°C to 65°C
  • Humidity: 5% to 95% (non-condensing)
  • Shock: 3 axis, 35g, 25ms
  • Vibration: 4.76Grms, 4Hz to 2000 Hz (SSD)
  • Altitude: 10,000 ASL


  • Temperature: -40°C to 80°C
  • Humidity: 5% to 95% (non-condensing)
  • Altitude: 40,000 ASL
  • Conformal Coating: IPC-CC 830 (optional)


  • Height: 3U or 5.25 inches (133.35mm)
  • Width: 17 inches (431.8mm)
  • Depth: 20 inches (208mm)
  • Weight (Typical)*:
    • Steel Chassis: 38lbs (17.2kg)
  • Cooling: Internal fan-cooled (rear vent) front to rear
  • 19” rackmountable

* Mercury Systems designs all products to meet or exceed listed data sheet specifications. Some specifications including I/O profiles, weight, and thermal profiles are configuration dependent. Contact Mercury for information specific to your desired configuration requirements.

Configurable to your HPC Field Application

Equipped with 11 PCIe 3.0 slots that accommodate a mix of GPUs, FPGA accelerators and other expansion cards, RES AI 3U accelerates an array of high performance computing (HPC) workloads in the field by consolidating multiple capabilities into a single platform. Sixteen hot-pluggable, front-access drives support the latest 2.5", 15mm high and 7mm high SAS3, SATA and NVME drives and can be configured for redundancy. 

To ensure sustained optimal performance in almost any environment, our 3U server minimizes airborne and structural noise and is certified to multiple International Electrotechnical Commission (IEC) and military standard specifications including MIL-STD 810G, 901D, 167-1, 1474D, 740-2 and 461F. Patented memory stabilization technology prevents disconnect during system shock and vibration.

Maximize Throughput with Parallel Computing

Powered by five of the latest NVIDIA® Volta architecture GPUs, RES AI 3U harnesses parallel processing to maximize throughput, boost productivity and push the boundaries of compute-heavy mission-critical applications such as signal intelligence (SIGINT), cryptography, deep learning, artificial intelligence (AI), surveillance, sensor fusion, visualization, image processing, tracking and big data analytics. Other GPU options are available. 

Scale Supercomputing Applications from the Cloud to the Edge

Compatible with multiple operating systems, applications and software, RES AI adheres to open standards and integrates the latest commercial technologies to support supercomputing from the cloud to the edge. 

The RES AI 3U is designed in the U.S. and manufactured in AS5553 compliant, AS9100D and ISO9001 facilities to maintain stringent quality standards.


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