Embedded Composable Data Center
SFM6126 are critical scaling components for your truly composable high performance embedded edge computing (HPEEC) solution. When integrated with other EnsembleSeries OpenVPX compute building blocks, including the latest data center Intel Xeon Scalable blades, powerful GPU co-processing engines, the power of the data center is put into your application. These big data processing solutions are tailorable to your platform and can deployed in the harshest and most SWaP constrained environments.
The Anatomy of a Rugged OpenVPX Module
EnsembleSeries building blocks use proven conduction, liquid and air cooling, rugged packaging and high-speed in-system switch fabric interconnect technologies which are open systems compliant and have a technology readiness level of nine (TRL-9). SFM6126 switches are well suited to your defense system that requires the utmost in reliable processing performance and are available with data center in-chassis fabric performance and optional MOTS+ technology for extreme environmental protection.
Affordable, Interoperable and Upgradable
Place the best technology into the hands of service men and women faster by building your next HPEEC processing solution with EnsembleSeries compute modules that are made with open architectures for interoperability, scalability and re-use. Further drive affordability, performance and lower your program risk by using the architecture that evolves at the speed of technology, follows industry technology roadmaps and leverages data center hardware, software and IP.
Gain a Competitive Edge
Deploy next generation automatous platforms, cognitive EW systems, compute-intensive EO/IR, AI and radar processing, and sensor fusion applications that require data center-class capabilities closer to the source of data origin – at the edge. Efficiently process streaming data over a distributed heterogeneous PCIe-enabled architecture from the cloud to the edge with a seamless and common compute architecture that integrates the latest commercial capabilities for affordability and low program risk.
- Full Gen3 PCIe high-bandwidth switching
- 16 ports of 10 Gigabit Ethernet control plane switching
- I/O distribution for PCIe data plane or expansion/sensor plane
- Transparent or non-transparent port-by-port bridging
- Dual XMC I/O mezzanine sites
- VITA 46.11 system management
- Optional MOTS+ rugged packaging for extreme environmental protection
- Designed, built, coded and supported from trusted DMEA facilities
- 6U OpenVPX, standard 1-inch pitch module
- Weight 2 to 3Kg depending upon configuration
Other HPEEC Building Blocks