Military-Grade High-Density Memory

Solve size, weight and power (SWaP) challenges with high-density memory in a low-profile package

Shrink Your Memory Footprint up to 87%

Our trusted and secure memory is designed for high reliability in harsh environments using advanced three-dimensional (3D) packaging techniques, offering lower power, high-speed performance for the most demanding application requirements. Applying advanced miniaturization technology, we deliver space savings up to 87%.

FEATURED PRODUCT

HD DDR3 - 4GB

Our newest high capacity memory in a small, rugged form factor

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MEMORY

DDR Products

DDR Products

Compact and rugged BGA memory devices for size, weight and power (SWaP) constrained applications

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Embedded NOR Flash

Embedded NOR Flash

Guarantee reliable system operations in harsh environments

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EEPROM Memory

EEPROM Memory

Protect long-term system investments

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INTEGRATED MANUFACTURING

From Chip Scale to System Scale

From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies documented and certified—to minimize your risk.  

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RESOURCES

High Density Secure Memory Tech Brief

This technical brief examines Mercury's portfolio of High Density Secure Memory products, a unique...

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Enabling Edge Processing with Stacked, High-Speed DDR4 and DDR5 Memory

The real-time processing of data requires fastest FPGA devices and multicore processors. These...

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Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)

At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs...

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Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can...

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Contact us to see how we can solve your mission-critical challenges

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