Military-Grade High-Density Memory

Solve size, weight and power (SWaP) challenges with high-density memory in a low-profile package

Shrink Your Memory Footprint up to 87%

Our trusted and secure memory is designed for high reliability in harsh environments using advanced three-dimensional (3D) packaging techniques, offering lower power, high-speed performance for the most demanding application requirements. Applying advanced miniaturization technology, we deliver space savings up to 87%.

FEATURED PRODUCT

HD DDR3 - 4GB

Our newest high capacity memory in a small, rugged form factor

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MEMORY

DDR Products

DDR Products

Compact and rugged BGA memory devices for size, weight and power (SWaP) constrained applications

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Embedded NOR Flash

Embedded NOR Flash

Guarantee reliable system operations in harsh environments

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EEPROM Memory

EEPROM Memory

Protect long-term system investments

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INTEGRATED MANUFACTURING

From Chip Scale to System Scale

From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies documented and certified—to minimize your risk.  

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RESOURCES

Military-Grade High-Density DDR Memory Product Brief

Compact and rugged DDR memory components for SWaP-constrained applications

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High-Density DDR for the Tactical Edge Infographic

Processing large volumes of data in rugged environments away from climate-controlled data centers...

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On Demand: Overcoming Memory Design Challenges in High-Performance Edge Computing

In this webinar, discover how to address memory design challenges at the sensor edge with modern...

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White Paper: Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can...

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Contact us to see how we can solve your mission-critical challenges

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