Military-Grade High-Density Memory
Solve size, weight and power (SWaP) challenges with high-density memory in a low-profile package
Mercury Systems Completes Acquisition of Physical Optics Corporation. Learn More.
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Solve size, weight and power (SWaP) challenges with high-density memory in a low-profile package
Our trusted and secure memory is designed for high reliability in harsh environments using advanced three-dimensional (3D) packaging techniques, offering lower power, high-speed performance for the most demanding application requirements. Applying advanced miniaturization technology, we deliver space savings up to 87%.
HD DDR3 - 4GB
Our newest high capacity memory in a small, rugged form factor
INTEGRATED MANUFACTURING
From custom microelectronics to complex systems, our integrated manufacturing capability leverages common processes and innovative technologies documented and certified—to minimize your risk.
This technical brief examines Mercury's portfolio of High Density Secure Memory products, a unique...
The real-time processing of data requires fastest FPGA devices and multicore processors. These...
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs...
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can...
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