System-in-Package & Multi-Chip Modules

Accelerate edge computing deployment with trusted, high-performance system-in-package and multi-chip module solutions integrating the latest in commercial silicon technology

Redefining Sensor Edge Processing

2.5D System-in-Package Technology

Tom Smelker, VP and General Manager at Mercury Systems, shares how 2.5D microelectronics integration in semiconductor design is a powerful new trend that will redefine edge processing in the smallest form factor possible.

LEARN MORE

TRUSTED MICROELECTRONICS

Fast, Flexible and Built for Purpose

The power of our game-changing chiplet technology, coupled with our next-generation trusted microelectronics capabilities, provides up to 75% reduction in lead time, thousands of customizable configurations and reliable performance.   

DISCOVER MORE

DISCOVER MORE

On Demand: Accelerating Defense Microelectronics Through Our Digital Transformation

In this webinar, we discuss four decades of innovative 2D and 2.5D microelectronics packaging and...

SEE MORE

Leading the Way With Edge Processing

As technology scales, traditional AI processing in facilities away from the battlefield is no longer...

SEE MORE

A Trusted and Secure Ecosystem for Microelectronics

As the Pentagon continues to make microelectronics modernization a number-one priority in light of...

SEE MORE

Enabling a Trusted Domestic Microelectronics Ecosystem

Mercury Systems is a next-generation defense electronics company making commercial technologies...

SEE MORE