System-in-Package & Multi-Chip Modules

Accelerate edge computing deployment with trusted, high-performance system-in-package and multi-chip module solutions integrating the latest in commercial silicon technology

Redefining Sensor Edge Processing

2.5D System-in-Package Technology

Tom Smelker, VP and General Manager at Mercury Systems, shares how 2.5D microelectronics integration in semiconductor design is a powerful new trend that will redefine edge processing in the smallest form factor possible.

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TRUSTED MICROELECTRONICS

Fast, Flexible and Built for Purpose

The power of our game-changing chiplet technology, coupled with our next-generation trusted microelectronics capabilities, provides up to 75% reduction in lead time, thousands of customizable configurations and reliable performance.   

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A Novel RF and Digital Microelectronics Architecture for Precision Guided Weapons

Developing a precision-guided capability small enough to fit into a munition that weighs less than...

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Understanding Broadband Electrical Behavior of Through-Silicon-Via (TSV)

At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs...

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Redefining Sensor Edge Processing with 2.5D System-in-Package Technology

By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can...

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DefenseNews Outlook 2020

Presenting leaders from around the world & their perspective on the state of global security....

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