System-in-Package and Multi-Chip Modules

Accelerate edge computing deployment with trusted, high-performance system-in-package and multi-chip module solutions integrating the latest in commercial silicon technology

Massive Chip-Scale Performance in the Smallest Form Factors Possible

At Mercury, we make cutting-edge commercial technologies profoundly more accessible to all customers and seamlessly customize them for today’s most advanced A&D applications. Leveraging high-density 2.5D system-in-package technology, custom-designed silicon interposers and 3D die-stacking integration, we partner with leading semiconductor manufacturers to deliver advanced technology to the harshest environments.

Redefining Sensor Edge Processing

2.5D System-in-Package Technology

Tom Smelker, VP and General Manager at Mercury Systems, shares how 2.5D microelectronics integration in semiconductor design is a powerful new trend that will redefine edge processing in the smallest form factor possible.

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TRUSTED MICROELECTRONICS

Fast, Flexible and Built for Purpose

The power of our game-changing chiplet technology, coupled with our next-generation trusted microelectronics capabilities, provides up to 75% reduction in lead time, thousands of customizable configurations and reliable performance.   

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Video Interview: Revving Up the Sensor Open Systems Architecture Edition 2.0

Mercury Systems' Rodger Hosking talks to Electronic Design's Bill Wong about the latest SOSA...

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What's the big deal with ACAP technology?

Learn about ACAP technology and how it's contributing to faster, stronger and more capable systems...

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Revolutionizing microelectronics with chipletized architectures

A flexible design approach integrates individual intellectual property (IP) blocks called chiplets. ...

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Delivering RF signal processing solutions to the edge with MOSA

Today's pace of technology development means the traditional approach of custom-designed modules and...

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