System-in-Package & Multi-Chip Modules
Accelerate edge computing deployment with trusted, high-performance system-in-package and multi-chip module solutions integrating the latest in commercial silicon technology
Mercury Systems Completes Acquisition of Physical Optics Corporation. Learn More.
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Accelerate edge computing deployment with trusted, high-performance system-in-package and multi-chip module solutions integrating the latest in commercial silicon technology
Mission-critical applications at the tactical edge drive demand for low-latency processing in ever-shrinking form factors, leading to an emerging need for compact, high-performance signal processing solutions. We partner with high-tech industry leaders to make the latest in commercial silicon profoundly more accessible to the aerospace and defense industry. Our system-in-package solutions integrate this silicon with customizable chiplets, plus the added benefits of advanced security, trusted manufacturing and long-term supply that only Mercury can deliver.
Redefining Sensor Edge Processing
Tom Smelker, VP and General Manager at Mercury Systems, shares how 2.5D microelectronics integration in semiconductor design is a powerful new trend that will redefine edge processing in the smallest form factor possible.
TRUSTED MICROELECTRONICS
The power of our game-changing chiplet technology, coupled with our next-generation trusted microelectronics capabilities, provides up to 75% reduction in lead time, thousands of customizable configurations and reliable performance.
Developing a precision-guided capability small enough to fit into a munition that weighs less than...
At the epicenter of modern 3D and 2.5D package design is through-silicon-via (TSV) technology. TSVs...
By working at the chip level and leveraging new 2.5D system-in-package capabilities, designers can...
Presenting leaders from around the world & their perspective on the state of global security....
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