RFS1140 RF System-in-Package

High-speed, 64 GSPS sensor processing at the edge

AI-Core Based RF SiP

High-speed sensor processing at the edge

The RFS1140 is a system-in-package device is designed, developed and manufactured onshore offering direct digitization and high speed processing in a SWaP-C optimized form factor. The RF SiP contains a Versal FPGA, high speed data converters, and integrated power and memory for a truly advanced solution to sensor processing at the edge.

U.S. design and manufacturing
AI Core with Xilinx® Versal® technology
Ultra-fast data conversion rates of 64GSPS with Jariet technology
On chip memory and power management

DOWNLOAD PRODUCT BRIEF

Direct Digitization at 64 GSPS and Versal AI Processing At Chip Scale

Countering the latest adversarial radar and EW threats requires extremely low-latency responses driven by intelligent, adaptive technology. Addressing this evolving need requires innovation from chip scale to system scale—including powerful system-in-package devices. Learn how Mercury is partnering with the semiconductor industry leaders to deliver trusted microelectronic solutions.

READ THE WHITE PAPER

RF SiP-based board vs. typical discrete board solution

83%

Smaller in size

64%

Lighter in weight

74%

More power efficient

48%

Less expensive

Features Specifications Resources

Features

Technology

Advanced commercial semiconductor technology
Versal Adaptive Compute Acceleration Platform (ACAP) processor
4 channel ADC & DAC conversion rates from 40 to 64 GSPS with Jariet Electra-MA transceiver
On-chip power and memory

Packaging

Compact size measuring 50 mm by 50 mm
Defense-grade package and chip-level security integration

Manufacturing

DMEA-trusted facility manufacturing

Customization

Rapid customization of commercial and customer chiplets

DOWNLOAD PRODUCT BRIEF

CONTACT AN EXPERT

Specifications

Performance

4 channels each of ADC & DAC with conversion rates from 40 to 64 GSPS
Operation in 1st Nyquist zone up to 32 GHz
ADC & DAC directly digitize frequencies through 36 GHz
Broad instantaneous bandwidth > 4 GHz

Memory

4 GB LPDDR4
- 4266 Mbps max data rate
- 1600 MHZ max clock speed
256M x 32
2 Gb NOR Flash

Power Supply

Integrated power regulation
Power with POL
- Max power 145 W, Typical 125 W

Mechanicals

Dimensions
- 50 x 50 x 5 mm with integrated power
- 50 x 40 x 5 mm without integrated power
Operating temperature range -40 C to +85 C
Storage Temperature -55 C to +105 C

Resources

White Paper: The New SiP Device Drives a Leap in RF Edge Processing

eBook: What's the big deal about ACAP?

Product Brief

Webinar: Bringing AI to the Tactical Edge