RFS1140 Direct RF System-in-Package (SiP)

Direct RF multi-chip module (MCM) with AMD Versal FPGA, high-speed sensor processing, and wideband data converters

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AI-Core Based RF SiP

High-speed sensor processing at the edge

The RFS1140 is a system-in-package device is designed, developed and manufactured onshore offering direct digitization and high speed processing in a SWaP-C optimized form factor. The RF SiP contains a Versal FPGA, high speed data converters, and integrated power and memory for a truly advanced solution to sensor processing at the edge.

  • North American design and manufacturing
  • AI Core with AMD Versal® technology
  • Ultra-fast data conversion rates of 64GSPS with Jariet technology
  • On chip memory and power management


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Direct Digitization at 64 GSPS and Versal AI Processing At Chip Scale

Countering the latest adversarial radar and EW threats requires extremely low-latency responses driven by intelligent, adaptive technology. Addressing this evolving need requires innovation from chip scale to system scale—including powerful system-in-package devices. Learn how Mercury is partnering with the semiconductor industry leaders to deliver trusted microelectronic solutions.

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RF SiP-based board vs. typical discrete board solution

83%
Smaller in size
64%
Lighter in weight
74%
More power efficient
48%
Less expensive
Features

Technology

  • Advanced commercial semiconductor technology
  • Versal Adaptive Compute Acceleration Platform (ACAP) processor
  •  4 channel ADC & DAC conversion rates from 40 to 64 GSPS with Jariet Electra-MA transceiver
  • On-chip power and memory

Packaging

  • Compact size measuring 50 mm by 50 mm
  • Defense-grade package and chip-level security integration

Manufacturing

  • DMEA-trusted facility manufacturing

Customization

  • Rapid customization of commercial and customer chiplets
  • Evaluation Board for rapid prototyping
Specifications

Performance

  • 4 channels each of ADC & DAC with conversion rates from 40 to 64 GSPS
  • Operation in 1st Nyquist zone up to 32 GHz
  • ADC & DAC directly digitize frequencies through 36 GHz
  • Broad instantaneous bandwidth > 4 GHz

Memory

  • 4 GB LPDDR4
    • 4266 Mbps max data rate
    • 1600 MHZ max clock speed
  • 256M x 32
  • 2 Gb NOR Flash

Power Supply

  • Integrated power regulation
  • Power with POL
    • Max power 145 W, Typical 125 W

Mechanicals

  • Dimensions
    • 50 x 50 x 5 mm with integrated power
    • 50 x 40 x 5 mm without integrated power
  • Operating temperature range -40 C to +85 C
  • Storage Temperature -55 C to +105 C

 

RESOURCES

Webinar: Solving EW & SIGINT Signal Acquisition & Latency Challenges

Learn how RF signal analysis, Direct RF technology, signal processing solutions and other components...

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White Paper: The New SiP Device Drives a Leap in RF Edge Processing

This white paper focuses on a dynamic new answer to the RF edge processing challenge, an adaptation...

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Webinar: Solving High-Bandwidth Data Transfer and Memory Access in Data Converter Systems

Using technologies like high-bandwidth memory, high-bit-rate optical interfaces and gigabit serial...

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Video: Learn about Mercury's industry leading capabilities in 2.5D SiP microelectronics

Bringing trust and supply chain security to the latest commercial semiconductor solutions requires...

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