RFS1140 RF System-in-Package

High-speed, 64 GSPS sensor processing at the edge

  • slide

AI-Core Based RF SiP

High-speed sensor processing at the edge

The RFS1140 is a system-in-package device is designed, developed and manufactured onshore offering direct digitization and high speed processing in a SWaP-C optimized form factor. The RF SiP contains a Versal FPGA, high speed data converters, and integrated power and memory for a truly advanced solution to sensor processing at the edge.

  • U.S. design and manufacturing
  • AI Core with Xilinx® Versal® technology
  • Ultra-fast data conversion rates of 64GSPS with Jariet technology
  • On chip memory and power management


DOWNLOAD PRODUCT BRIEF

SIGN UP FOR UPDATES

Direct Digitization at 64 GSPS and Versal AI Processing At Chip Scale

Countering the latest adversarial radar and EW threats requires extremely low-latency responses driven by intelligent, adaptive technology. Addressing this evolving need requires innovation from chip scale to system scale—including powerful system-in-package devices. Learn how Mercury is partnering with the semiconductor industry leaders to deliver trusted microelectronic solutions.

READ THE WHITE PAPER

SWAP-C Comparison

RF SiP-based board vs. typical discrete board solution

83%
Smaller in size
64%
Lighter in weight
74%
More power efficient
48%
Less expensive
Features

Technology

  • Advanced commercial semiconductor technology
  • Versal Adaptive Compute Acceleration Platform (ACAP) processor
  •  4 channel ADC & DAC conversion rates from 40 to 64 GSPS with Jariet Electra-MA transceiver
  • On-chip power and memory

Packaging

  • Compact size measuring 50 mm by 50 mm
  • Defense-grade package and chip-level security integration

Manufacturing

  • DMEA-trusted facility manufacturing

Customization

  • Rapid customization of commercial and customer chiplets
Specifications

Performance

  • 4 channels each of ADC & DAC with conversion rates from 40 to 64 GSPS
  • Operation in 1st Nyquist zone up to 32 GHz
  • ADC & DAC directly digitize frequencies through 36 GHz
  • Broad instantaneous bandwidth > 4 GHz

Memory

  • 4 GB LPDDR4
    • 4266 Mbps max data rate
    • 1600 MHZ max clock speed
  • 256M x 32
  • 2 Gb NOR Flash

Power Supply

  • Integrated power regulation
  • Power with POL
    • Max power 145 W, Typical 125 W

Mechanicals

  • Dimensions
    • 50 x 50 x 5 mm with integrated power
    • 50 x 40 x 5 mm without integrated power
  • Operating temperature range -40 C to +85 C
  • Storage Temperature -55 C to +105 C

 

RELATED PRODUCTS

DCM3220 Digital Transceiver

DCM3220 Digital Transceiver

3U OpenVPX 6.4 GSPS Converter Ultrascale+ FPGA

SEE MORE

HDS6605 6U OpenVPX Multiprocessing Board

HDS6605 6U OpenVPX Multiprocessing Board

Intel Xeon Scalable 22-core server-class CPU, 192 GB DDR4, 100 GbE, PCIe Gen3, MOTS+ protection

SEE MORE

Custom Device Packaging & Integration

Custom Device Packaging & Integration

Trusted 2.5D system-in-package and multi-chip module solutions

SEE MORE

SCFE6931 ACAP Processing Module

SCFE6931 ACAP Processing Module

Dual Versal AI Core FPGA Processing Board

SEE MORE

RESOURCES

White Paper: Designer's Journey: Navigating the Transition to Versal ACAP

Optimized to solve the most advanced radar, cognitive EW and AI challenges, learn how Mercury ’s...

SEE MORE

Webinar: Technology advancements in data storage and system interfaces for high-speed data recording

Use the latest technology that allow real-time recording systems to keep up with the ever-increasing...

SEE MORE

Webinar: Solving High-Bandwidth Data Transfer and Memory Access in Data Converter Systems

Using technologies like high-bandwidth memory, high-bit-rate optical interfaces and gigabit serial...

SEE MORE

Video: Learn about Mercury's industry leading capabilities in 2.5D SiP microelectronics

Bringing trust and supply chain security to the latest commercial semiconductor solutions requires...

SEE MORE