RFS1140 Direct RF System-in-Package (SiP)

The first direct RF multi-chip module with AMD Versal™

High-speed direct RF processing

The RFS1140 is the first multi-chip module to combine the processing power of the AMD Versal™ AI Core series adaptive SoC, along with Jariet Technologies high-speed data converters. The RFS1140 features four channels of ADC/DAC with sample rates up to 64 Gsps and analog bandwidth of 32 GHz for broad spectrum analysis. Fast boot capabilities delivered with 4 Gb flash memory, while 4 GB LPDDR4 memory enables real-time DSP and AI/ML computation. 

Built for Edge and Military Environments

Designed, manufactured, and tested in DMEA accredited facilities, the RFS1140 mitigates supply chain security risks. It operates in extended -40° to 85°C temperatures and is qualified to MIL-STD 883 to function reliably when subjected to shock, vibration, altitude, and humidity. Custom ruggedization options include military temperature ranges, gun-hardening, and radiation tolerance. The RFS1140 can also be customized with physical security, cryptography, and secure boot options that protect confidential data and IP. 

RFS1140 Web Image.png

Join the early access program

Get ahead of development by joining the early access program for the RFS1140, including product documentation and support as well as priority delivery for evaluation hardware as it becomes available this year.

LEARN MORE

High-Speed Direct Digitization at the Edge

64 Gsps
4 channel ADC/DACs
6.4 GHz
IBW per channel
4 GB
LPDDR4 memory
4 Gb
NOR flash
Features
  • An integrated AMD Versal Adaptive SOC with 400 AI engines provides up to 5X higher compute density for vector-based algorithms
  • 4 channel ADC & DAC conversion rates from 40 to 64 GSPS with Jariet Electra-MA transceiver
  • High-speed 64 GSPs data converters that detect up to 32 GHz analog bandwidth
  • Micron 4 GB low-power LPDDR4 and 4Gb NOR flash memory 
  • Evaluation board for quick integration and prototyping

Packaging and Manufacturing

  • Compact size measuring 47.5 mm by 47.5 mm
  • -40°C to +85°C operating temperature range
  • MIL-STD 883 shock, vibration, altitude and humidity
  • Designed, manufactured and tested in onshore DMEA-trusted facilities

Customization Options

  • Custom chiplet integration
  • Gun-hardening
  • Radiation tolerance for space environments
  • Military environments 
  • Device ID capabilities
  • Secure boot and runtime
  • Cryptography
  • Classified and ITAR design options

 

Specifications

Performance

  • 4 channels each of ADC & DAC with conversion rates from 40 to 64 GSPS
  • Operation in 1st Nyquist zone up to 32 GHz
  • ADC & DAC directly digitize frequencies through 36 GHz
  • Broad instantaneous bandwidth > 4 GHz

Memory

  • 4 GB LPDDR4
    • 4266 Mbps max data rate
    • 1600 MHZ max clock speed
  • 256M x 32
  • 2 Gb NOR Flash

Power Supply

  • Integrated power regulation
  • Power with POL
    • Max power 145 W, Typical 125 W

Mechanicals

  • Dimensions: 47.5 x 47.5 x 5 mm 
  • Operating temperature range -40°C to +85°C
  • Storage Temperature -55°C to +105°C

 

WHITE PAPER

A New SiP Device For Direct RF Edge and AI Processing

READ THE WHITE PAPER

WEBINAR

Bringing Artificial Intelligence to the Tactical Edge with AMD Versalâ„¢ Adaptive SOC

WATCH THE WEBINAR

ARTICLE

Electronic warfare systems demand multifunctionality and integration in RF and microwave designs

READ THE ARTICLE

The Undoable is Now Doable

Groundbreaking direct RF technology with wide bandwidth and a low-latency A/D to D/A processing path allows larger portions of the RF spectrum to be efficiently captured, processed, and transmitted expediently at the edge.

LEARN MORE

RELATED PRODUCTS

DRF2580 Direct RF FPGA System on Module

DRF2580 Direct RF FPGA System on Module

SEE MORE

Model 2757 100 GigE rugged rackmount recorder

Model 2757 100 GigE rugged rackmount recorder

SEE MORE

Model 5560 Versal HBM ACAP Coprocessor

Model 5560 Versal HBM ACAP Coprocessor

SEE MORE

DISCOVER MORE

Webinar: Solving EW & SIGINT Signal Acquisition & Latency Challenges

Learn how RF signal analysis, Direct RF technology, signal processing solutions and other components...

SEE MORE

Microwave Journal Interview: Direct RF Technology for A&D Applications

Microwave Journal interviews Mercury System' Rodger Hosking on direct RF technology for A&D...

SEE MORE

Webinar: Advantages and Trade-Offs with Direct RF for Next-Generation Embedded Systems

This webinar talks about the advantages of direct RF compared with traditional superheterodyne...

SEE MORE

eBook: What's the Big Deal About ACAP Technology?

Next-gen EW systems require processing high-volume sensor data in harsh, SWaP-constrained...

SEE MORE