RFS1140 RF System-in-Package

High-speed, 64 GSPS sensor processing at the edge

AI-Core Based RF SiP

High-speed sensor processing at the edge

The RFS1140 is a system-in-package device is designed, developed and manufactured onshore offering direct digitization and high speed processing in a SWaP-C optimized form factor. The RF SiP contains a Versal FPGA, high speed data converters, and integrated power and memory for a truly advanced solution to sensor processing at the edge.

North American design and manufacturing
AI Core with Xilinx® Versal® technology
Ultra-fast data conversion rates of 64GSPS with Jariet technology
On chip memory and power management

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Direct Digitization at 64 GSPS and Versal AI Processing At Chip Scale

Countering the latest adversarial radar and EW threats requires extremely low-latency responses driven by intelligent, adaptive technology. Addressing this evolving need requires innovation from chip scale to system scale—including powerful system-in-package devices. Learn how Mercury is partnering with the semiconductor industry leaders to deliver trusted microelectronic solutions.

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RF SiP-based board vs. typical discrete board solution

83%

Smaller in size

64%

Lighter in weight

74%

More power efficient

48%

Less expensive

Features Specifications Resources

Features

Technology

Advanced commercial semiconductor technology
Versal Adaptive Compute Acceleration Platform (ACAP) processor
4 channel ADC & DAC conversion rates from 40 to 64 GSPS with Jariet Electra-MA transceiver
On-chip power and memory

Packaging

Compact size measuring 50 mm by 50 mm
Defense-grade package and chip-level security integration

Manufacturing

DMEA-trusted facility manufacturing

Customization

Rapid customization of commercial and customer chiplets

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Specifications

Performance

4 channels each of ADC & DAC with conversion rates from 40 to 64 GSPS
Operation in 1st Nyquist zone up to 32 GHz
ADC & DAC directly digitize frequencies through 36 GHz
Broad instantaneous bandwidth > 4 GHz

Memory

4 GB LPDDR4
- 4266 Mbps max data rate
- 1600 MHZ max clock speed
256M x 32
2 Gb NOR Flash

Power Supply

Integrated power regulation
Power with POL
- Max power 145 W, Typical 125 W

Mechanicals

Dimensions
- 50 x 50 x 5 mm with integrated power
- 50 x 40 x 5 mm without integrated power
Operating temperature range -40 C to +85 C
Storage Temperature -55 C to +105 C

Resources

White Paper: The New SiP Device Drives a Leap in RF Edge Processing

eBook: What's the big deal about ACAP?

Product Brief

Webinar: Bringing AI to the Tactical Edge