RFS1140 RF System-in-Package
High-speed, 64 GSPS sensor processing at the edge
High-speed, 64 GSPS sensor processing at the edge
RF SiP-based board vs. typical discrete board solution
3U OpenVPX 6.4 GSPS Converter Ultrascale+ FPGA
Intel Xeon Scalable 22-core server-class CPU, 192 GB DDR4, 100 GbE, PCIe Gen3, MOTS+ protection
Trusted 2.5D system-in-package and multi-chip module solutions
2 Versalâ„¢ ACAPs, 48GB DDR4
This white paper focuses on a dynamic new answer to the RF edge processing challenge, an adaptation...
Using technologies like high-bandwidth memory, high-bit-rate optical interfaces and gigabit serial...
Bringing trust and supply chain security to the latest commercial semiconductor solutions requires...
Heterogeneous 2.5D system-in-package (SiP) technology is proving to be an excellent match for...